플라즈마 표면처리에 의한 폴리카보네이트의 표면에너지 및 구리박막과의 접착력 변화에 관한 연구

조병훈; 이원종; 박영호; Byeong-Hoon Cho; Won-Jong Lee; Young-Ho Park

Korean Journal of Materials Research, Vol.15, No.11, 745-750, November, 2005

DOI10.3740/MRSK.2005.15.11.745 Export Citation

플라즈마 표면처리에 의한 폴리카보네이트의 표면에너지 및 구리박막과의 접착력 변화에 관한 연구

The Effects of Plasma Treatments on the Surface Energy of the Polycarbonates and on the Adhesion Strength of the Cu Film/Polycarbonate Interface

조병훈, 이원종^†, 박영호¹

한국과학기술원 신소재공학과
¹㈜선익시스템

Byeong-Hoon Cho, Won-Jong Lee^†, and Young-Ho Park¹

Department of Materials and Engineering, KIST, Dajeon, 305-701, Korea
¹Sunic System Ltd., Suwon, Gyunggido, 443-758, Korea

E-mail:

Polycarbonates are widely used as housing materials of electronic handsets. Since the polycarbonate is electrically insulating, there should be a conducting layer on the polycarbonate for EMI shielding. In this study, we sputter deposited Cu films on the polycarbonate substrates for EMI shielding. Plasma treatments of polycarbonates were used to increase the adhesion strength of the Cu film/polycarbonate interface. The surface energy of the polycarbonate was greatly increased from [Math Processing Error] by a 200 W [Math Processing Error] plasma treatment for 10s. It is thought that this is because of the ion bombardment. The adhesion strength of the sputter deposited Cu film to the polycarbonate was quantitatively measured by a 4 point bending tester. A moderate plasma surface treatment of the polycarbonate increased the Cu film/polycarbonate adhesion strength by [Math Processing Error] . The EMI shielding efficiency of the sputter deposited [Math Processing Error] Cu lam on the polycarbonate showed 90dB in the range of 100MHz to 1000MHz.

Keywords:plasma treatment;polycarbonate;adhesion;surface energy;EMI shield

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[1] Petasch W, Rauchle E, Walker M, Elsner P, Surf. Coat. Tech., 74-75, 682 (1995)

[2] Vallon S, Hofrichter A, Drevillon B, Klembergsapieha JE, Martinu L, Poncinepaillard F, Thin Solid Films, 290-291, 68 (1996)

[3] Dayss E, Leps G, Meinhardt J, Surf. Coat. Tech., 116-119, 986 (1999)

[4] Chan CM, Ko TM, Hiraoka H, Surf. Sci. Rep., 24, 1 (1996)

[5] Kim JH, Lee SB, Earmme YY, in Proceedings of the 3rd International Symposium on Electronic Materials and Packagings 2001 (Cheju, Korea, November 2001). p. 376-381 (2001)

[6] Fowkes FM, Ind. Eng. Chem., 56(12), 40 (1964)

[7] Owens DK, Wendt RC, J. Appl. Polym. Sci., 13, 1741 (1969)

[8] Marais S, Metayer M, Poncin-Epaillard F, J. Fluorine Chem., 107, 199 (2001)