SnAgCu계 무연솔더의 전기화학적 반응에 따른 타펠 특성

홍원식; 김광배; Won Sik Hong; Kwang-Bae Kim

Korean Journal of Materials Research, Vol.15, No.8, 536-542, August, 2005

DOI10.3740/MRSK.2005.15.8.536 Export Citation

SnAgCu계 무연솔더의 전기화학적 반응에 따른 타펠 특성

Tafel Characteristics by Electrochemical Reaction of SnAgCu Pb-Free Solder

홍원식^{1, 2, †}, 김광배¹

¹한국항공대학교 항공재료공학과
²전자부품연구원 신뢰성평가센터

Won Sik Hong^{1, 2, †}, and Kwang-Bae Kim¹

¹Department of Materials Engineering, Hankuk Aviation University, Gyeonggi, 412-791, Korea
²Reliability and Failure Analysis Center, Korea Electronics Tecnology Institute, Gyeonggi, 463-816, Korea

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Recently European Council(EU) published the RoHS(restriction of the use of certain hazardous substances in electrical and electronic equipment) which is prohibit the use of Pb, Hg, Cd, Cr +6 , PBB or PBDE in the electrical and electronic equipments. So EU member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain 6 hazardous substances. The one of the most important in electronics manufacturing process is soldering. Soldering process use the chemical substances which are applied in fluxing and cleaning processes and it can generate the malfunction of electronics caused by corrosion in the fields conditions. Therefore this study researched on the polarization and Tafel properties of Sn40Pb and Sn3.0Ag0.5Cu(SAC) solder based on the electrochemical theory. We prepared SnPb specimens which was aged in 150 ? C,180 ? C for 15 minutes ana Sn3.0Ag0.5Cu specimens that was aged in 180 ? C,220 ? C for 10 minutes. Experimental polarization curves were measured in distilled ionized water and 3.5wt% , 1 mole NaCl electrolyte of 40 ? C , pH 7.5. Ag/AgCl and graphite were utilized by reference and counter electrode, respectively. To observe the electrochemical reaction, polarization test was conducted from -250 mV to +250 mV. From the polarization curves that were composed of anodic and cathodic curves, we obtained Tafel slop, reversible electrode potential(Ecorr) and exchange current density(Icorr). In these results, corrosion rate for two specimen were compared Sn3.0Ag0.5Cu with SnPb solders

Keywords:Pb-free soldering;SnAgCu;intermetallic compounds;corrosion rate;RoHS

[References]

Directive 2002/95/EC of the European Parliament and of the Council, Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, EU (2003) (2003)
Jones DA, Principles and Prevention of Corrosion, p.74, Macmillan Pub. Company, New York (1992) (1992)
Fontama MG, Corrosion Eng., 3rd Ed., McGraw-Hill Int. Ed., New York (1988) (1988)
Suganuma K, Huh SH, Kim K, N, Nakamura Y, Mater. Trans., 42, 286 (2001)
Leda free soldering project final report, JEITA, Tokyo (2000) (2000)
JEITA, Lead Free Soldering Tech., Corona Pub. Co. Ltd., Tokyo (2003) (2003)
Wagner C, Traund W, Z. Electrochem., 44, 391 (1938)
Kim KS, Huh SH, Suganuma K, Int. Conf. on Electronics Packaging, 89 (2002)
Moon W, J. of Electron. Mater., 29(10), 1122 (2000)
Jang JW, Kim PG, Tu KN, Frear DR, Thompson P, J. of Appl. Phys., 85, 8456 (1999)
Strauss R, SMT Soldering Handbook, 2nd Ed., p.148, Newnes, Oxford (1998) (1998)
Hong WS, Kang BC, Song BS, Kim KB, Kor. J. of Mater. Res., 15(1), 54 (2005)
Suganuma K, Lead free soldering in electronics, p.57, Marcel Dekker Inc. New York (2004) (2004)

[Referenced By]

[1] Directive 2002/95/EC of the European Parliament and of the Council, Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, EU (2003) (2003)

[2] Jones DA, Principles and Prevention of Corrosion, p.74, Macmillan Pub. Company, New York (1992) (1992)

[3] Fontama MG, Corrosion Eng., 3rd Ed., McGraw-Hill Int. Ed., New York (1988) (1988)

[4] Suganuma K, Huh SH, Kim K, N, Nakamura Y, Mater. Trans., 42, 286 (2001)

[5] Leda free soldering project final report, JEITA, Tokyo (2000) (2000)

[6] JEITA, Lead Free Soldering Tech., Corona Pub. Co. Ltd., Tokyo (2003) (2003)

[7] Wagner C, Traund W, Z. Electrochem., 44, 391 (1938)

[8] Kim KS, Huh SH, Suganuma K, Int. Conf. on Electronics Packaging, 89 (2002)

[9] Moon W, J. of Electron. Mater., 29(10), 1122 (2000)

[10] Jang JW, Kim PG, Tu KN, Frear DR, Thompson P, J. of Appl. Phys., 85, 8456 (1999)

[11] Strauss R, SMT Soldering Handbook, 2nd Ed., p.148, Newnes, Oxford (1998) (1998)

[12] Hong WS, Kang BC, Song BS, Kim KB, Kor. J. of Mater. Res., 15(1), 54 (2005)

[13] Suganuma K, Lead free soldering in electronics, p.57, Marcel Dekker Inc. New York (2004) (2004)