NiO를 첨가한 WO 3 박막의 미세 구조 거동

김광호; 나동명; 최광표; 박진성; Gwang-Ho Kim; Dong-Myong Na; Gwang-Pyo Choi; Jin-Seong Park

Korean Journal of Materials Research, Vol.15, No.7, 486-490, July, 2005

DOI10.3740/MRSK.2005.15.7.486 Export Citation

NiO를 첨가한 WO 3 박막의 미세 구조 거동

The behavior of WO 3 Thin Film on NiO Addition

김광호, 나동명, 최광표¹, 박진성^†

조선대학교 신소재공학과
¹전남 신소재기술산업화 지원센터

Gwang-Ho Kim, Dong-Myong Na, Gwang-Pyo Choi¹, and Jin-Seong Park^†

Department of Materials Science and Engineering, Chosun University, Gwangju, Korea
¹JAMIC, Sunchun, Jeonnam, Korea

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Thin films of tungsten oxide and nickel oxide were deposited on [Math Processing Error] by high vacuum thermal evaporation. The properties of microstructure and crystallinity were analyzed by SEM and XRD respectively. [Math Processing Error] films without addition of NiO showed polycrystalline structure after annealing at [Math Processing Error] for SO min. There were the cracks between the polycrystalline grains and the crack width was increased with the thickness of [Math Processing Error] films. The cracks in the [Math Processing Error] films could be controlled by an optimum deposition of NiO on [Math Processing Error] films and either less or more than the optimum addition fails to suppress the cracks. A process mechanism to suppress the crack has been discussed.

Keywords:Thermal Evaporation;microstructure control

[References]

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[1] Seiyama T, Kato A, Fujishi K, Nagatani M, Anal. Chem., 34, 1502 (1962)

[2] Suehl JS, Cavicchi RZ, Gaiton M, Semancik S, IEEE Electron Device Letters, 14, 118 (1993)

[3] Xu XQ, Shen H, Xiong XY, Thin Solid Films, 415(1-2), 290 (2002)

[4] Salinga C, Weis H, Wutting M, Thin Solid Films, 414, 282 (2002)

[5] Stolze M, Camin B, Galbert F, Reinholz U, Thomas LK, Thin Solid Films, 409(2), 254 (2002)