웨이퍼의 2단 이면공정이 반도체 칩의 휨 강도에 미치는 영향

이성민; Seong Min Lee

Korean Journal of Materials Research, Vol.15, No.3, 183-188, March, 2005

DOI10.3740/MRSK.2005.15.3.183 Export Citation

웨이퍼의 2단 이면공정이 반도체 칩의 휨 강도에 미치는 영향

The Effect of Dual Wafer Back-Lapping Process on Flexural Strength of Semiconductor Chips

이성민^†

인천대학교 신소재공학부

Seong Min Lee^†

Department of Materials Science and Engineering, University of Incheon, Incheon 402-749, Korea

E-mail:

It was studied in this article how the flexural strength of bare silicon chips is influenced by adopting dual wafer back-lapping process. The experimental results showed that an additional finishing process after the conventional grinding process improves the flexural strength of bare chips by more than 2-fold. In particular, this work showed that the proper removal of the grinding marks (Ra=0.1μm) existing on the wafer back-surface resulting from the grinding process significantly contiributes to the enhancement of chip strength.

Keywords:wafer;back-lapping;chip crack;flexural strength

[References]

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[1] Broek D, Elementary Engineering Fracture Mechanics, 170 (1983)

[2] Lau JH, Thermal Stress and Strain in Microelectronics Packaging, 422 (1993)

[3] Hawkins G, Berg H, Mahalingam M, Lewis G, Lofgran, Pro. 25th Int. Reliability Phys. Symp, 216 (1987)

[4] Lim TB, Proc. 25th Int. Reliability Phys. Symp, 131 (1989)

[5] Nishiguchi M, Goto N, Nishizawa H, IEEE CPMT, 14, 523 (1991)

[6] Mizuishi K, Tokuda M, Fujita Y, IEEE CPMT, 11, 447 (1988)

[7] Vidano RP, Paananen DW, Miers TH, Krause-Singh JM, Agricola KR, Hauser RL, IEEE CPMT, 12, 612 (1987)

[8] Nishiguchi M, Goto N, Sekiguchi T, Nishizawa H, Hayashi H, Ono K, IEEE CPMT, 13, 528 (1990)

[9] Lee SM, Sim SM, Chung TW, Jang YK, Cho HK, JJAP Part 1, 6A, 3374 (1997)

[10] Pecht MG, Nguyen LT, Hakin EB, PlasticEncapsulated Microelectronics (John Wiley and Sons, Inc., 1995) 242 (1995)