Korean Journal of Materials Research, Vol.14, No.7, 516-521, July, 2004
중수소 프라즈마 처리가 다결정 실리콘 TFT의 안정성에 미치는 영향에 관한 연구
A Study on the Effect of Plasma Deuterium Treatment on Reliability of Poly-Silicon Thin Film Transistors
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We applied a deuterium plasma treatment to the surface of polycrystalline silicon films using PECVD and observed the change with AFM, XRD, ET-IR, and SIMS measurement. A bias temperature stressing (BTS) test was carried out to evaluate the reliability of the thin-film transistors (TFT). TFTs with channel lengths as small as 2 μm were electrically stressed fer up to 1000 sec at room temperature. From the parameter variation such as s-factor, leakage current and on/off ratio, we suggest that the deuterium plasma treatment suppress the hot carrier effect and improve the stability of TFTs.
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