고주파용 유전체 세라믹 공진기의 표면처리

박해덕; 강성군; Hae-Duck Park; Sung-Goon Kang

Korean Journal of Materials Research, Vol.11, No.11, 923-928, November, 2001

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고주파용 유전체 세라믹 공진기의 표면처리

Surface Treatment of Dielectric Ceramic Resonator for High Frequency Devices

박해덕^†, 강성군 ¹

해송 P&C
¹한양대학교 재료공학부

Hae-Duck Park^†, and Sung-Goon Kang¹

Hae Song P&C Corp., Korea
¹HanYang University, Korea

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An electrolytic silver plating process has been successfully developed for terminated electrode parts of dielectric ceramic resonator. High adhesion strength and high Qu is obtained and blister occurance is minimized under plating condition with HNO 3 750 mℓ/ℓ and HF 250mℓ/ℓ solution at 25 ? C for 20 minutes. Adhesion strength has the highest value, 3.2 kg/mm 2 at etching temperature of 25 ? C . Adhesion strength, Qu and blister occurance are monotonically increased with the thickness of electrodeposition layer. In case of electrodeposition of Ag, Qu value of 380 has obtained higher than in case of electrolytic Cu plating with Qu value of 325. Therefore, terminated electrode parts of dielectric ceramic resonator reducing dielectric loss can be obtained using prensent process.

Keywords:유전체 세라믹 공진기;무전해구리;전기 은도금;밀착강도;에칭;Dielectric ceramic resonator;Electroless copper;Electrolytic silver Plating;Adhesion strength;Etching

[References]

Chung TS, The Effect of Crystallographic Structure on High Frequency Dielectric Properties in(Pb 1?x Ca x )(Zr 1?y Sn y )O 3 Ceramics, Ph.D Thesis, pp. 17-39, 1995 (1995)
Koo KD, Effects of glass frits on sintering and dielectric characteristics of dielectric ceramics, Ph.D Thesis, pp. 110-135, 1998 (1998)
丸山淸, 毛利秀明, 機能めつき, 日刊工業新聞社, pp. 114
Metal Finishing Guide Book & Directory, p. 110, 1986 (1986)
Horkans J, J. Electrochem. Soc., 126, 1861 (1979)
Adock JL, AES Illustrated Lecture, No.44, 'Electroplating Plastics', 1980 (1980)
Meek RL, Cohen RL, Cullis AG, Proceedings AES Fifth Plat. in the Elec. Ind. Symp., East Orange, NJ, 146 (1975)
Electroless Copper Film for Additive Printed Boards, Standard Specification, IPC-372, IPC Pub., 1717 Howard St., Evanton ILC, 1978 (1978)
Weil R, Plat. Surf. Fin., 69, 46 (1982)
Brenner A, Riddle G, J. Res. Nat. Bur. Stds, 37 (1946)
Hatsukawa T, Osaka T, Chiba K, J. Met. Finish. Soc. Jpn., 45(5) (1994)
Ohno I, Haruyama S, Surf. Technol., 13 (1981)

[Related Articles]

[1] Chung TS, The Effect of Crystallographic Structure on High Frequency Dielectric Properties in(Pb 1?x Ca x )(Zr 1?y Sn y )O 3 Ceramics, Ph.D Thesis, pp. 17-39, 1995 (1995)

[2] Koo KD, Effects of glass frits on sintering and dielectric characteristics of dielectric ceramics, Ph.D Thesis, pp. 110-135, 1998 (1998)

[3] 丸山淸, 毛利秀明, 機能めつき, 日刊工業新聞社, pp. 114

[4] Metal Finishing Guide Book & Directory, p. 110, 1986 (1986)

[5] Horkans J, J. Electrochem. Soc., 126, 1861 (1979)

[6] Adock JL, AES Illustrated Lecture, No.44, 'Electroplating Plastics', 1980 (1980)

[7] Meek RL, Cohen RL, Cullis AG, Proceedings AES Fifth Plat. in the Elec. Ind. Symp., East Orange, NJ, 146 (1975)

[8] Electroless Copper Film for Additive Printed Boards, Standard Specification, IPC-372, IPC Pub., 1717 Howard St., Evanton ILC, 1978 (1978)

[9] Weil R, Plat. Surf. Fin., 69, 46 (1982)

[10] Brenner A, Riddle G, J. Res. Nat. Bur. Stds, 37 (1946)

[11] Hatsukawa T, Osaka T, Chiba K, J. Met. Finish. Soc. Jpn., 45(5) (1994)

[12] Ohno I, Haruyama S, Surf. Technol., 13 (1981)