As a major step in the conduction of heat dissipation, wafer bonding significantly contributes to device reliability. This work presents the Cu-Sn eutectic bonding with a Mo buffer layer for light emitting diodes to increase its reliability. The conventional Ag-paste bonding and Cu-Sn bonding (without Mo top layer) are also studied for comparison. Their reliability is measured using thermal shock treatments ranging from -40 to 120 degrees C (200 cycles). Experimental results indicate that the eutectic bonding with a Mo buffer layer demonstrates a better device performance than the other two counterparts. Following thermal shock treatment, the light droops for the Ag-paste, Cu-Sn, and Mo/Cu-Sn bonding samples are 15, 11 and 7%, respectively. Additionally, the increasing ratios of thermal resistance are 26, 33 and 19%, respectively. Moreover, adding the Mo buffer layer can relieve the thermal stress problem, owing to the thermal expansion mismatch in Gallium-Nitride/Cu-Sn/submount wafer bonding structures. (C) 2014 Elsevier B.V. All rights reserved.