We propose a simple taper angle control technique which can be easily achieved by using conventional thin-film deposition and wet etching processes. Based on the proposed technique, the taper angle can be controlled below 30 degrees by varying the thickness of the shade layer which will support the top layer by means of the thin-film stiction phenomenon. By applying the proposed technique to the thin-film line resistor structure, we can confirm that variations of the resistance and the heat generation of the thin-film line formed cross the shade structured multiple thin-film line bumps can be suppressed below 6%, while those of the line resistor formed over multiple line bumps without the shade layer are increased by 54.5% and 246.6%, respectively. (C) 2014 Elsevier B.V. All rights reserved.