Macromolecular Research, Vol.23, No.4, 320-324, April, 2015
Cure behaviors and thermal stabilities of tetrafunctional epoxy resin toughened by polyamideimide
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The effect of polyamideimide (PAI) content on the cure behaviors and thermal stabilities of 4,4′-tetraglycidyl diaminodiphenyl methane (TGDDM) epoxy resin/polyamideimide (PAI) blends was investigated. The experimental results revealed that the main exothermic peak and cure activation energy (E a ) of the blends decreased with increasing PAI content, presumably because the curing reaction was accelerated by the presence of secondary amine groups of the PAI backbone. The decomposition activation energy (E d ) of the blends was maximized at 5 phr PAI and decreased above this content; this was attributed to the short-chain structural network in TGDDM/PAI blends, which was derived from etherification and chain-scission reactions caused by the secondary amine of PAI.
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