다층구조형 아크릴 점착제의 분자량 및 피착재 종류에 따른 접착특성

김동복; Dong-Bok Kim

Polymer(Korea), Vol.39, No.3, 514-521, May, 2015

DOI10.7317/pk.2015.39.3.514 Export Citation

다층구조형 아크릴 점착제의 분자량 및 피착재 종류에 따른 접착특성

Adhesion Properties on the Molecular Weight and Various Substrates of Multi-layered Structural Acrylic Adhesive

김동복 ^†

광에너지소재연구센터, 고분자공학과 단국대학교

Dong-Bok Kim^†

Center for Photofunctional Energy Materials, Dept. of Polymer Science and Engineering, Dankook University, #126 Jukjeon-dong, Sugi-ku, Yongin-si, Gyeonggi-do 448-701, Korea

E-mail:

초록

본 연구는 자동차, 건축, 디스플레이 부품 접합 등에 사용되는 다층구조형 양면 점착테이프에 대한 것으로 UV 경화에 의해 제조된 아크릴폼 기재에 용제 건조형 점착제(AD)를 양면에 붙이고 피착제 종류에 따른 박리강도와 전단접착강도를 고찰하였다. AD 종류와 기재 조성에 따른 접착력 변화 및 피착재로 사용한 플라스틱에 대한 접착력을 고찰한 결과, AD의 분자량(MW)이 증가할수록 박리강도 및 전단접착강도가 증가하였으나 약 65만 이상의 MW를 가진 AD는 접착력이 감소하는 거동을 보였다. 양면 점착테이프에 사용된 AD층 두께가 얇을수록 온도감소와 함께 높은 물성 값을 보였다. 기재와 AD와의 계면접합 특성은 MW 615000(AD-4)을 사용한 것이 가장 우수하였으며, MW가 615000보다 낮으면 기재인 아크릴 폼과의 계면이 분리되는 결과를 보였다. 따라서 본 연구에서 검토한 다층구조형 양면 점착테이프는 표면에너지가 낮은 플라스틱 부품 및 곡면 부위에 적용가능한 산업분야에 유용하게 사용될 수 있을 것으로 판단된다.

In this study, we would like to describe peel strength and dynamic shear property on various substrates of multi-layered structural double-sided adhesive tape with or without adhesive (AD) prepared by UV curing for an automobile, construction, and display junction. According to adapt the adhesive, the peel and dynamic shear strength of adhesion tape prepared with acrylic foam or various plastic substrates increased with increasing molecular weight, however, decreased over 650000 molecular weight. The adhesion property shows high value at the thin AD layer with decreasing temperature. The interface property shows highest at MW 615000 (AD-4), and the interface junction below MW 615000 resulted to divide from acrylic foam and adhesive layer. From this study, the multi-layered structural doublesided adhesive tapes seem to be a useful for industrial area such as a low surface energy plastic material and curved substrate.

Keywords:multi-layer;UV curing;double-sided adhesive tape;molecular weight;substrate

[References]

Choi HJ, Park IS, Jang L, Korean Patent 100852887(2008). (2008)
Cho IH, Korean Patent 1020080109275 (2008). (2008)
Satas D, Handbook of Pressure Sensitive Adhesive Technology, 2nd edition, Van Nostrand Reinhold, New York, 1989. (1989)
Levine IW, U.S. Patent 1,537 (1926). (1926)
Bened I, Pressure-Sensitive Adhesive and Applications, 2nd edition, Marcel Dekker, New York, 2004. (2004)
Baek SS, Jang SJ, Lee JH, Kho DH, Lee SH, Hwang SH, Polym.(Korea), 38(2), 199 (2014)
Lee SJ, So JY, Park C, Ban TG, Park LS, J. Appl. Sci., 10, 1104 (2010)
Park JW, Lee SW, Kim HJ, Won DB, Kim DB, Lee KS, Woo HS, Kim EA, J. Adhes. Interf., 12, 81 (2011)
Kim DB, Polym.(Korea), 37(2), 184 (2013)
Ellerstein SM, Lee SA, Palit TK. Radiation Curing in Polymer Science and Technology, Fouassier JP, Rabek JF, Editors, Elsevier, Applied Science, London, UK, Vol. 4 (1993). (1993)
Goss B, Int. J. Adhes. Adhes., 22, 405 (2002)
Do HS, Kim DJ, Kim HJ, J. Adhes. Interf., 4, 41 (2003)
Song YW, Do HS, Joo HS, Lim DH, Kim S, Kim HJ, J. Adhes. Sci. Technol., 20(12), 1357 (2006)
Kale V, Moukwa M, J. Electrost., 38, 239 (1996)
Leftheriotis G, Papaefthimiou S, Solid State Ion., 136, 655 (2000)
Piglowski J, Kozlowski M, Rheol. Acta, 24, 519 (1985)
Czech Z, Int. J. Adhes. Adhes., 24, 503 (2004)
Kim DB, Polym.(Korea), 38(3), 397 (2014)
Sosson F, Chateauminois A, Creton C, J. Polym. Sci. B: Polym. Phys., 43(22), 3316 (2005)

[Referenced By]

[Related Articles]

[1] Choi HJ, Park IS, Jang L, Korean Patent 100852887(2008). (2008)

[2] Cho IH, Korean Patent 1020080109275 (2008). (2008)

[3] Satas D, Handbook of Pressure Sensitive Adhesive Technology, 2nd edition, Van Nostrand Reinhold, New York, 1989. (1989)

[4] Levine IW, U.S. Patent 1,537 (1926). (1926)

[5] Bened I, Pressure-Sensitive Adhesive and Applications, 2nd edition, Marcel Dekker, New York, 2004. (2004)

[6] Baek SS, Jang SJ, Lee JH, Kho DH, Lee SH, Hwang SH, Polym.(Korea), 38(2), 199 (2014)

[7] Lee SJ, So JY, Park C, Ban TG, Park LS, J. Appl. Sci., 10, 1104 (2010)

[8] Park JW, Lee SW, Kim HJ, Won DB, Kim DB, Lee KS, Woo HS, Kim EA, J. Adhes. Interf., 12, 81 (2011)

[9] Kim DB, Polym.(Korea), 37(2), 184 (2013)

[10] Ellerstein SM, Lee SA, Palit TK. Radiation Curing in Polymer Science and Technology, Fouassier JP, Rabek JF, Editors, Elsevier, Applied Science, London, UK, Vol. 4 (1993). (1993)

[11] Goss B, Int. J. Adhes. Adhes., 22, 405 (2002)

[12] Do HS, Kim DJ, Kim HJ, J. Adhes. Interf., 4, 41 (2003)

[13] Song YW, Do HS, Joo HS, Lim DH, Kim S, Kim HJ, J. Adhes. Sci. Technol., 20(12), 1357 (2006)

[14] Kale V, Moukwa M, J. Electrost., 38, 239 (1996)

[15] Leftheriotis G, Papaefthimiou S, Solid State Ion., 136, 655 (2000)

[16] Piglowski J, Kozlowski M, Rheol. Acta, 24, 519 (1985)

[17] Czech Z, Int. J. Adhes. Adhes., 24, 503 (2004)

[18] Kim DB, Polym.(Korea), 38(3), 397 (2014)

[19] Sosson F, Chateauminois A, Creton C, J. Polym. Sci. B: Polym. Phys., 43(22), 3316 (2005)