화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Journal of Industrial and Engineering Chemistry, Vol.24, 20-23, April, 2015
DOI10.1016/j.jiec.2014.10.006  Export Citation
Synthesis and thermal properties of urethane-containing epoxy resin
Fan-Long Jin†, Heng-Chang Liu, Baoqing Yang1, and Soo-Jin Park2, †
  • Department of Polymer Materials, Jilin Institute of Chemical Technology, Jilin City 132022, People’s Republic of China
  • 1Jilin City Scientific & Technological Information Institute, Jilin City 132013, People’s Republic of China
  • 2Department of Chemistry, Inha University, Nam-gu, Incheon 402-751, South Korea
E-mail:,
A urethane-containing epoxy resin was successfully synthesized by reacting bisphenol A with 1,6-hexamethylene diisocyanate and epichlorohydrin. The chemical structure of urethane-containing epoxy resin was confirmed using FT-IR, 1HNMR, and elemental analysis. DSC results indicated that the initial curing and maximum exothermic peak temperatures of urethane-containing epoxy resin cured with 4,4′-diaminodiphenylmethane were 60 °C and 135 °C, respectively; these values were lower than those of a bisphenol A-based epoxy resin. The thermal stability of epoxy resins was studied using TGA, and it was found that the degradation temperature of urethane-containing epoxy resin was lower than that of bisphenol A-based epoxy resin under the same conditions.
Keywords:Urethane;Epoxy resin;Bisphenol A;Initial curing temperature;Thermal decomposition temperature
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