포토마스크 펠리클 제조를 위한 Aluminum Frame 표면 세정공정 연구

김현태; 김향란; 김민수; 이준; 장성해; 최인찬; 박진구; Hyun-Tae Kim; Hyang-Ran Kim; Min-Su Kim; Jun Lee; Sung-Hae Jang; In-Chan Choi; Jin-Goo Park

Korean Journal of Materials Research, Vol.25, No.9, 462-467, September, 2015

DOI10.3740/MRSK.2015.25.9.462 Export Citation

포토마스크 펠리클 제조를 위한 Aluminum Frame 표면 세정공정 연구

Study on Aluminum Frame Surface Cleaning Process for Photomask Pellicle Fabrication

김현태¹, 김향란¹, 김민수¹, 이준¹, 장성해¹, 최인찬¹, 박진구 ^{1, 2, †}

¹한양대학교 바이오나노학과
²한양대학교 재료공학과

Hyun-Tae Kim¹, Hyang-Ran Kim¹, Min-Su Kim¹, Jun Lee¹, Sung-Hae Jang¹, In-Chan Choi¹, and Jin-Goo Park^{1, 2, †}

¹Department of Bionano Technology, Hanyang University, Korea
²Department of Metallurgy & Materials Engineering, Hanyang University, Korea

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Pellicle is defined as a thin transparent film stretched over an aluminum (Al) frame that is glued on one side of a photomask. As semiconductor devices are pursuing higher levels of integration and higher resolution patterns, the cleaning of the Al flame surface is becoming a critical step because the contaminants on the Al flame can cause lithography exposure defects on the wafers. In order to remove these contaminants from the Al frame, a highly concentrated nitric acid (HNO3) solution is used. However, it is difficult to fully remove them, which results in an increase in the Al surface roughness. In this paper, the pellicle frame cleaning is investigated using various cleaning solutions. When the mixture of sulfuric acid (H2SO4), hydrofluoric acid (HF), hydrogen peroxide (H2O2), and deionized water with ultrasonic is used, a high cleaning efficiency is achieved without HNO3. Thus, this cleaning process is suitable for Al frame cleaning and it can also reduce the use of chemicals.

Keywords:lithography;photomask;pellicle;aluminum alloys;SMUT;ultrasonic cleaning

[References]

Jaeger RC, Introduction to Microelectronic Fabrication, 5th ed., p.17-25, Prentice-Hall, Inc., USA (2002).
Choo ST, Choi SK, KR Patent No. 10-0519463 (2005).
de Frutos A, Arenas MA, Liu Y, Skeldon P, Thompson GE, de Damborenea J, Surf. Coat. Technol., 202, 3797 (2008)
Nelson KJH, Hughes AE, Taylor RJ, Hinton BRW, Wilson L, Henderson M, Mater. Sci. Technol., 17, 1211 (2001)
Dunbar C, ASM Handbook, Volume 05 - Surface Engineering, p.335-338, ASM International Handbook Committee, ASM Handbook, USA (1994).
Choo ST, Choi SK, Clean Technol., 9, 58 (2003)
Davis JR, Corrosion of Aluminum and Aluminum Alloys, p.251-259, ASM International, USA (1999).
O’Keefe TJ, Yu P, Encyclopedia of Materials:Science and Technology, p.7774-7781, Elsevier, Netherlands (2001).
Revie RW, Uhlig’s Corrosion Handbook, 2nd ed., John Wiley & Sons Inc., USA (2000).
Fournier V, Marcus P, Olefjord I, Surf. Interface Anal., 34, 494 (2002)

[Related Articles]

[1] Jaeger RC, Introduction to Microelectronic Fabrication, 5th ed., p.17-25, Prentice-Hall, Inc., USA (2002).

[2] Choo ST, Choi SK, KR Patent No. 10-0519463 (2005).

[3] de Frutos A, Arenas MA, Liu Y, Skeldon P, Thompson GE, de Damborenea J, Surf. Coat. Technol., 202, 3797 (2008)

[4] Nelson KJH, Hughes AE, Taylor RJ, Hinton BRW, Wilson L, Henderson M, Mater. Sci. Technol., 17, 1211 (2001)

[5] Dunbar C, ASM Handbook, Volume 05 - Surface Engineering, p.335-338, ASM International Handbook Committee, ASM Handbook, USA (1994).

[6] Choo ST, Choi SK, Clean Technol., 9, 58 (2003)

[7] Davis JR, Corrosion of Aluminum and Aluminum Alloys, p.251-259, ASM International, USA (1999).

[8] O’Keefe TJ, Yu P, Encyclopedia of Materials:Science and Technology, p.7774-7781, Elsevier, Netherlands (2001).

[9] Revie RW, Uhlig’s Corrosion Handbook, 2nd ed., John Wiley & Sons Inc., USA (2000).

[10] Fournier V, Marcus P, Olefjord I, Surf. Interface Anal., 34, 494 (2002)