젖음성 차이와 무전해도금을 이용한 연성 구리 회로패턴 형성

박상진; 고태준; 윤주일; 문명운; 한준현; Sang-Jin Park; Tae-Jun Ko; Juil Yoon; Myoung-Woon Moon; Jun Hyun Han

Korean Journal of Materials Research, Vol.25, No.11, 622-629, November, 2015

DOI10.3740/MRSK.2015.25.11.622 Export Citation

젖음성 차이와 무전해도금을 이용한 연성 구리 회로패턴 형성

Etchless Fabrication of Cu Circuits Using Wettability Modification and Electroless Plating

박상진, 고태준¹, 윤주일², 문명운¹, 한준현^†

충남대학교 신소재공학과
¹한국과학기술연구원 계산과학연구센터
²한성대학교 기계시스템 공학과

Sang-Jin Park, Tae-Jun Ko¹, Juil Yoon², Myoung-Woon Moon¹, and Jun Hyun Han^†

Department of Materials Science and Engineering, Chungnam National University, Daejeon 34134, Korea
¹Computational Science Research Center, Korea Institute of Science and Technology, Seoul 02792, Korea
²Department of Mechanical System Engineering, Hansung University, Seoul 02786, Korea

E-mail:

Cu circuits were successfully fabricated on flexible PET(polyethylene terephthalate) substrates using wettability difference and electroless plating without an etching process. The wettability of Cu plating solution on PET was controlled by oxygen plasma treatment and SiOx-DLC(silicon oxide containing diamond like carbon) coating by HMDSO(hexamethyldisiloxane) plasma. With an increase of the height of the nanostructures on the PET surface with the oxygen plasma treatment time, the wettability difference between the hydrophilicity and hydrophobicity increased, which allowed the etchless formation of a Cu pattern with high peel strength by selective Cu plating. When the height of the nanostructure was more than 1400 nm (60 min oxygen plasma treatment), the reduction of the critical impalement pressure with the decreasing density of the nanostructure caused the precipitation of copper in the hydrophobic region.

Keywords:flexible substrate;Cu circuit;wettability;electroless plating;nanostructure

[References]

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Cho YR, Lee YS, Rha SK, Korean J. Mater. Res., 23(11), 661 (2013)
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Kumar A, Biebuyck HA, Whitesides GM, Langmuir, 10(5), 1498 (1994)
Courbin L, Denieul E, Dressaire E, Roper M, Ajdari A, Stone HA, Nat. Mater., 6(9), 661 (2007)
Barthlott W, Neinhuis C, Planta, 202, 1 (1997)
Tsougeni K, Vourdas N, Tserepi A, Gogolides E, Cardinaud C, Langmuir, 25(19), 11748 (2009)
Ko TJ, Oh KH, Moon MW, Adv. Mater. Interfaces, 2, 140043 (2015)
Paunovic M, Modern Electroplating, 5th ed., p.433, Schlesinger M, Paunovic M, ECS, New Jersey, USA (2010).
Li LS, Li XR, Zhao WX, Ma Q, Lu XB, Wang ZL, Int. J. Electrochem. Sci., 8, 5191 (2013)
Whyman G, Bormashenko E, Stein T, Chem. Phys. Lett., 450(4-6), 355 (2008)
Woo K, Kim D, Kim JS, Lim S, Moon J, Langmuir, 25, 429 (2008)
Cassie ABD, Discuss. Faraday Soc., 3, 11 (1948)
Quere D, Nat. Mater., 1(1), 14 (2002)
Marmur A, Langmuir, 19(20), 8343 (2003)
Wenzel RN, Ind. Eng. Chem., 28, 988 (1936)
Lafuma A, Quere D, Nat. Mater., 2(7), 457 (2003)
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Ishino C, Okumura K, Quere D, Europhys. Lett., 68, 419 (2004)
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Bartolo D, Bouamrirene F, Verneuil E, Buguin A, Silberzan P, Moulinet S, Europhys. Lett., 74, 299 (2006)
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[Referenced By]

[1] Kim HC, Rha SK, Lee YS, Korean J. Mater. Res., 24(11), 632 (2014)

[2] Cho YR, Lee YS, Rha SK, Korean J. Mater. Res., 23(11), 661 (2013)

[3] Hatano T, Kurosawa Y, Miyake J, J. Electron. Mater., 29, 611 (2000)

[4] Edqvist E, Snis N, Johansson S, JMM., 18, 015007 (2008)

[5] Calvert P, Chem. Mater., 13, 3299 (2001)

[6] Kumar A, Biebuyck HA, Whitesides GM, Langmuir, 10(5), 1498 (1994)

[7] Courbin L, Denieul E, Dressaire E, Roper M, Ajdari A, Stone HA, Nat. Mater., 6(9), 661 (2007)

[8] Barthlott W, Neinhuis C, Planta, 202, 1 (1997)

[9] Tsougeni K, Vourdas N, Tserepi A, Gogolides E, Cardinaud C, Langmuir, 25(19), 11748 (2009)

[10] Ko TJ, Oh KH, Moon MW, Adv. Mater. Interfaces, 2, 140043 (2015)

[11] Paunovic M, Modern Electroplating, 5th ed., p.433, Schlesinger M, Paunovic M, ECS, New Jersey, USA (2010).

[12] Li LS, Li XR, Zhao WX, Ma Q, Lu XB, Wang ZL, Int. J. Electrochem. Sci., 8, 5191 (2013)

[13] Whyman G, Bormashenko E, Stein T, Chem. Phys. Lett., 450(4-6), 355 (2008)

[14] Woo K, Kim D, Kim JS, Lim S, Moon J, Langmuir, 25, 429 (2008)

[15] Cassie ABD, Discuss. Faraday Soc., 3, 11 (1948)

[16] Quere D, Nat. Mater., 1(1), 14 (2002)

[17] Marmur A, Langmuir, 19(20), 8343 (2003)

[18] Wenzel RN, Ind. Eng. Chem., 28, 988 (1936)

[19] Lafuma A, Quere D, Nat. Mater., 2(7), 457 (2003)

[20] Reyssat M, Yeomans J, Quere D, Europhys. Lett., 81, 26006 (2008)

[21] Ishino C, Okumura K, Quere D, Europhys. Lett., 68, 419 (2004)

[22] Ishino C, Okumura K, Europhys. Lett. E, 25, 415 (2008)

[23] Bartolo D, Bouamrirene F, Verneuil E, Buguin A, Silberzan P, Moulinet S, Europhys. Lett., 74, 299 (2006)

[24] Moulinet S, Bartolo D, Europhys. Lett. E, 24, 251 (2007)

[25] Schultz J, Nardin M, Handbook of Adhesive Technology, 2nd ed., p.54, Pizzi A, Mittal KL, Marcel Dekker, Inc., New York, USA (2003).