은이 코팅된 이산화티탄 나노입자 및 도전성 페이스트 제조 특성

심상보; 이미재; 배동식; Sang-Bo Sim; Mi Chae Lee; Dong-Sik Bae

Korean Journal of Materials Research, Vol.25, No.12, 683-689, December, 2015

DOI10.3740/MRSK.2015.25.12.683 Export Citation

은이 코팅된 이산화티탄 나노입자 및 도전성 페이스트 제조 특성

Fabrication and Characterization of Silver-Coated Titanium Dioxide Nanoparticles for a Conductive Paste

심상보, 이미재¹, 배동식^†

국립창원대학교 메카트로닉스대학 나노신소재공학부
¹한국세라믹 기술원 광학 디스플레이이 팀

Sang-Bo Sim, Mi Chae Lee¹, and Dong-Sik Bae^†

Department of Advanced Materials Science and Engineering, Changwon National University, Changwon 641-773, Korea
¹Optic & Display Materials Team, Korea Institute of Ceramic Engineering & Technology, Jinju 660-031, Korea

E-mail:

In this study, the properties of Ag-coated TiO2 nanoparticles were observed, while varying the molar ratio of water and Ag+ for the surfactant and TiO2. According to the XRD results, each nanoparticle showed a distinctive diffraction pattern. The intensity of the respective peaks and the sizes of the nanoparticles increased in the order of AT1(R1 = 5)(33.3 nm), AT2 (R1 = 10)(38.1 nm), AT3(R1 = 20)(45.7 nm), AT4(R1 = 40)(48.6 nm) as well as AT5(R2 = 0.2, R3 = 0.5)(41.4 nm), AT6(R2 = 0.3, R3 = 1)(45.1 nm), AT7(R2 = 0.5, R3 = 1.5)(49.3 nm), AT8(R2 = 0.7, R3 = 2)(57.2 nm), which values were consistent with the results of the UV-Vis. spectrum. The surface resistance of the conductive pastes fabricated using the prepared Ag-coated TiO2 nanoparticles exhibited a range 7.0~9.0(274~328 μΩ/cm2) times that of pure silver paste(ATP)(52 μΩ/cm2).

Keywords:silver;titanium dioxide;nanoparticles;conductive paste;wet process

[References]

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Su W, Wei SS, Hu SQ, Tang JX, J. Hazard. Mater., 172(2-3), 716 (2009)
Kim YJ, Li Z, Kim DH, Lee DW, Ahn JH, J. Ceram. Process. Res., 10, 216 (2009)
Jin JH, Chu MC, Cho SJ, Bae DS, Trans. Nonferrous Met. Soc., 19, 96 (2009)
Park HR, Lee SW, Yoo IS, Appl. Chem. Eng., 23(3), 293 (2012)
Jamil NY, Najim SA, Muhammed AM, Rogoz VM, Proc. Int. Conference, 3, 3 (2014)
Gayathri S, Sathishkumar S, Appl. Sci. Lett., 1, 8 (2015)
Yang X, Xu L, Yu X, Guo Y, Catal. Commun., 9, 1124 (2008)
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Akpan UG, Hameed BH, Appl. Catal., 375, 1 (2010)
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Boutonnet M, Kizling J, Stenius P, Colloids Surf., 5, 209 (1982)
Andersson M, Pedersen JS, Palmqvist AEC, Langmuir, 21(24), 11387 (2005)
Bagwe RP, Khilar KC, Langmuir, 6, 905 (2000)
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Ghanbary F, Jafarian A, J. Basic Appl. Sci., 5, 2889 (2011)
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[Referenced By]

[1] Mai LX, Wang DW, Zhang S, Xie YJ, Huang CM, Zhang ZG, Appl. Surf. Sci., 257(3), 974 (2010)

[2] Su W, Wei SS, Hu SQ, Tang JX, J. Hazard. Mater., 172(2-3), 716 (2009)

[3] Kim YJ, Li Z, Kim DH, Lee DW, Ahn JH, J. Ceram. Process. Res., 10, 216 (2009)

[4] Jin JH, Chu MC, Cho SJ, Bae DS, Trans. Nonferrous Met. Soc., 19, 96 (2009)

[5] Park HR, Lee SW, Yoo IS, Appl. Chem. Eng., 23(3), 293 (2012)

[6] Jamil NY, Najim SA, Muhammed AM, Rogoz VM, Proc. Int. Conference, 3, 3 (2014)

[7] Gayathri S, Sathishkumar S, Appl. Sci. Lett., 1, 8 (2015)

[8] Yang X, Xu L, Yu X, Guo Y, Catal. Commun., 9, 1124 (2008)

[9] Zhang H, Chen G, Environ. Sci. Technol., 43, 2905 (2009)

[10] Chao HE, Yun YU, Xingfang HU, Larbot A, J. Eur. Ceram. Soc., 23, 1457 (2003)

[11] Akhavan O, J. Colloid Interface Sci., 336(1), 117 (2009)

[12] Akpan UG, Hameed BH, Appl. Catal., 375, 1 (2010)

[13] Yonezawa Y, Kometani N, Sakaue T, Yano A, J. Photochem. Photobiol., 171, 1 (2005)

[14] Boutonnet M, Kizling J, Stenius P, Colloids Surf., 5, 209 (1982)

[15] Andersson M, Pedersen JS, Palmqvist AEC, Langmuir, 21(24), 11387 (2005)

[16] Bagwe RP, Khilar KC, Langmuir, 6, 905 (2000)

[17] Boutonnet, Kizling J, Stenius P, Colloids Surf., 5, 209 (1982)

[18] Castillo N, Barriga LD, Perez R, Martinez-Ortiz MJ, Rev. Adv. Mater. Sci., 18, 72 (2008)

[19] Chen D, Liu S, Zhao N, Sheng J, J. Alloy. Compd., 475, 494 (2009)

[20] Chiang CL, Hsu MB, Lai LB, J. Solid State Chem., 177, 3891 (2004)

[21] Fu X, Qutubuddin S, Colloids Surf. A: Physicochem. Eng. Asp., 179, 65 (2001)

[22] Hong SS, Lee MS, Lee GD, React. Kinet. Catal. Lett., 80(1), 145 (2003)

[23] Ghanbary F, Jafarian A, J. Basic Appl. Sci., 5, 2889 (2011)

[24] Lopez-Quintela MA, Curr. Opin. Colloid Interface Sci., 8, 137 (2003)

[25] Han JK, Kim HC, Hong WS, Korean J. Mater. Res., 18, 7 (2008)

[26] Husein MM, Nassar NN, Curr. Nanoscience, 4, 370 (2008)

[27] Bagheri1 S, Ramimoghadam D, Yousefi AT, Int. J. Electrochem. Sci., 10, 3088 (2015)

[28] Zhang DB, Cheng HM, Ma JM, Wang YP, Gai XZ, J. Mater. Sci. Lett., 20(5), 439 (2001)

[29] Slistan-Grijalva A, Herrera-Urbina R, Rivas-Silva JF, Avalos-Borja M, Castillon-Barraza FF, Posada-Amarillas A, Mater. Res. Bull., 43(1), 90 (2008)

[30] Alistan-Grijalva A, Herrera-Urbina R, Physica E, 25, 438 (2005)

[31] Yeshchenko OA, dmitruk IM, Alexeenko AA, Ukr. J. Phys., 57, 2 (2012)

[32] Bohren CF, Huffman DR, John Wiley & Sons, Inc., New York, (1988).