폴리우레탄-실리카 하이브리드 해체성 접착제의 해체접착 특성

김동호; 김구니; 송경주; 정일두; Dongho Kim; Guni Kim; Gyeongju Song; Ildoo Chung

Polymer(Korea), Vol.40, No.2, 216-224, March, 2016

DOI10.7317/pk.2016.40.2.216 Export Citation

폴리우레탄-실리카 하이브리드 해체성 접착제의 해체접착 특성

Dismantlment Adhesion Properties of Dismantlable Polyurethane-Silica Hybrid Adhesive

김동호^{1, 2}, 김구니², 송경주¹, 정일두^{3, †}

¹부산대학교 고분자공학과
²한국신발피혁연구원
³부산대학교 고분자공학과, 송경주

Dongho Kim^{1, 2}, Guni Kim², Gyeongju Song^{1, 3}, and Ildoo Chung^{1, 3, †}

¹Department of Polymer Science & Engineering, Pusan National University, Busan 46241, Korea
²Korea Institute of Footwear & Leather Technology, Busan 47154, Korea
³, Korea

E-mail:

초록

열적 특성이 제어된 해체성 폴리우레탄 접착제의 해체특성을 연구하기 위해서, 특정 온도 범위에서 연화될 수 있는 열적 특성을 갖는 폴리우레탄-실리카 하이브리드 접착제를 합성하였으며 열팽창 마이크로캡슐을 혼합하여 해체성 접착제를 제조하였다. 시차 주사 열량계(DSC)와 동적 점탄성 측정기(DMA)를 사용하여 폴리우레탄의 열적특성을 확인하였고 폴리우레탄 수지의 종류, 가열인자의 종류 및 처리조건에 따른 접착력과 해체특성을 연구하였다. 마이크로웨이브 처리에 의해서 해체성 폴리우레탄 접착제로 접착된 시편의 해체가 가능하였으며, 폴리우레탄-실리카 하이브리드 수지를 사용한 경우 마이크로웨이브 2분 조사에 의해서 접착부위가 더 쉽게 분리되었다. 접착된 시편의 해체는 접착제의 연화와 열팽창 마이크로캡슐의 부피팽창으로 인한 접착제 층의 부피팽창에 의해서 이루어졌다. 그리고 접착시편의 해체를 위해서는 접착제가 열팽창 마이크로캡슐의 부피팽창 온도에서 충분히 낮은 저장탄성률(storage modulus)을 가져야하는 것으로 확인되었다.

In order to determine the dismantlement property of dismantlable polyurethane adhesive by controlling thermal property, polyurethane (PU)-silica hybrid adhesives with softening properties at a certain temperature were synthesized and used to fabricate dismantlable polyurethane adhesive by mixing with thermally expansive microcapsule. Their thermal properties were characterized by DSC and DMTA, and bonding strength as well as dismantlement properties were also evaluated depending on the type of PU, heating triggers, and treatment conditions. The specimens adhered by dismantlable PU adhesive were readily peeled off after the treatment of microwave irradiation, and those by PU-silica hybrid resin were much more easily peeled off after microwave irradiation for 2 min. This result was attributed to the softening of adhesive and volumetric expansion of thermally expansive microcapsule. In addition, the dismantlable adhesive should have low storage modulus at the expansion temperature of thermally expansive microcapsule to have dismantle adhesion properties.

Keywords:dismantlement;polyurethane-silica hybrid;dismantlable adhesive;microwave

[References]

Lie G, U.S. Patent 026111 (2006).
Sakurai H, Bulletin of Shizuoka Industrial Technology Research Center, 43, 11 (1998)
Hanafi M, Nishiyama Y, Sato C, Proceedings of EURADH, 133 (2002)
Hori K, Proceedings of JSME Colloquium, 86, 9 (2001)
Lee DS, Lee SY, Min BG, Seo YS, Lee BH, Park SJ, Polym. Korea, 38(6), 787 (2014)
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Shimotsuma S, J. Adhes. Soc. Jpn, 42, 445 (2006)
Kim DB, Polym. Korea, 39(3), 514 (2015)
Ishikawa H, Seto K, Shimotuma S, Adhesion Conference, 42, 169 (2004)
Nishiyama Y, Sato C, Uto N, J. Adhes. Soc. Jpn, 40, 298 (2004)
Kishi H, Sato C, J. Soc. Automotive Eng. Japan, 61, 43 (2007)
Kishi H, Inada Y, Imade J, UESAWA K, J. Adhes. Soc. Japan, 42, 356 (2006)
Clark K, U.S. Patent 046073 (2006).
Sato C, J. Adhes. Soc. Japan, 39, 295 (2003)
Ishikawa H, Proceedings of JSME Colloquium, 86, 5 (2001)
Nishiyama Y, Uto N, Sato C, Adhesion Conference, 41, 159 (2003)
Fukushima T, Mater. Trans., 46, 2567 (2005)
Ishikawa H, Seto K, Shimotuma S, Int. J. Adhes. Adhes., 25, 193 (2005)
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Iler RK, The Chemistry of Silica, Wiley, New York, 1979.
Vansant EF, Vrancjen KC, Characterization and Chemical Modification of the Silica Surface, Elsevier, Amsterdam, 1995.
Kishi H, Inada Y, Imade J, Uesawa K, J. Adhes. Soc. Japan, 42, 356 (2006)
Kim D, Chung I, Kim G, J. Adhes. Sci. Technol., 26(23), 2571 (2012)

[Referenced By]

[1] Lie G, U.S. Patent 026111 (2006).

[2] Sakurai H, Bulletin of Shizuoka Industrial Technology Research Center, 43, 11 (1998)

[3] Hanafi M, Nishiyama Y, Sato C, Proceedings of EURADH, 133 (2002)

[4] Hori K, Proceedings of JSME Colloquium, 86, 9 (2001)

[5] Lee DS, Lee SY, Min BG, Seo YS, Lee BH, Park SJ, Polym. Korea, 38(6), 787 (2014)

[6] Kishi H, Inada Y, Murakami A, International Conference on Composite Materials, Kyoto, Japan p.1-8 (2007).

[7] Shimotsuma S, J. Adhes. Soc. Jpn, 42, 445 (2006)

[8] Kim DB, Polym. Korea, 39(3), 514 (2015)

[9] Ishikawa H, Seto K, Shimotuma S, Adhesion Conference, 42, 169 (2004)

[10] Nishiyama Y, Sato C, Uto N, J. Adhes. Soc. Jpn, 40, 298 (2004)

[11] Kishi H, Sato C, J. Soc. Automotive Eng. Japan, 61, 43 (2007)

[12] Kishi H, Inada Y, Imade J, UESAWA K, J. Adhes. Soc. Japan, 42, 356 (2006)

[13] Clark K, U.S. Patent 046073 (2006).

[14] Sato C, J. Adhes. Soc. Japan, 39, 295 (2003)

[15] Ishikawa H, Proceedings of JSME Colloquium, 86, 5 (2001)

[16] Nishiyama Y, Uto N, Sato C, Adhesion Conference, 41, 159 (2003)

[17] Fukushima T, Mater. Trans., 46, 2567 (2005)

[18] Ishikawa H, Seto K, Shimotuma S, Int. J. Adhes. Adhes., 25, 193 (2005)

[19] Ishikawa H, J. Adhes. Soc. Japan, 40, 184 (2004)

[20] Nishiyama Y, Uto N, Sato C, Int. J. Adhes. Adhes., 23, 377 (2003)

[21] Sato C, J. Adhes. Soc. Japan, 11, 136 (2008)

[22] Iler RK, The Chemistry of Silica, Wiley, New York, 1979.

[23] Vansant EF, Vrancjen KC, Characterization and Chemical Modification of the Silica Surface, Elsevier, Amsterdam, 1995.

[24] Kishi H, Inada Y, Imade J, Uesawa K, J. Adhes. Soc. Japan, 42, 356 (2006)

[25] Kim D, Chung I, Kim G, J. Adhes. Sci. Technol., 26(23), 2571 (2012)