Square-wave unipolar pulse electroplating and bipolar pulse reverse electroplating of copper using an acid copper electrolyte of the type used for printed circuit boa rd production has been studied. The effects of pulse-plated coatings on cathode efficiency and on the coatings properties, such as surface roughness, microhardness, stress-strain characteristics and elongation, are reported. The results show that microhardness, tensile strength and elongation are directly affected by the pulse technique used.