Copper/aluminium laminates were prepared by roll bonding at different temperatures between 350 and 500 degrees C. The effect of the roll bonding temperature on the interface reactions and bond strength development of the laminates was investigated. It was found that the bond strength of the laminates was generally enhanced with increased roll bonding temperature up to 430 degrees C. Optimum roll bonding conditions, in terms of maximum bond strength were identified. It is shown that the development of the optimum bonding between the metal laminates is related to the creation of physical contact between the metals in the roll bonding stage and the formation of various intermetallic phases at the interface during the subsequent sintering process. The formation of intermetallic phases is greatly affected by the diffusivity of the metallic elements across the interface. It has been identified that dissolution of the interfacial oxide layer, formed in the roll bonding stage, has a great influence on the diffusivity of metallic elements across the interface which in turn determines the bond strength development of the material.