Previous Article Next Article Table of Contents Journal of Materials Science Letters, Vol.14, No.15, 1095-1098, 1995 DOI10.1007/BF00258175 Export Citation Properties of Copper-Aluminum Nitride Composites .2. Rele SV, Raman RV, Unni CK Keywords:HIGH THERMAL-CONDUCTIVITY Please enable JavaScript to view the comments powered by Disqus.
