Previous Article Next Article Table of Contents Journal of Materials Science Letters, Vol.15, No.16, 1457-1459, 1996 DOI10.1007/BF00275305 Export Citation Thermal-Diffusivity and Conductivity of Highly Filled Epoxies as Cover Materials for Microelectronical Devices as Measured by the Heat Pulse Technique Nyilas A, Rehme R, Wyrwich C, Springer H, Hinrichsen G [Referenced By] Please enable JavaScript to view the comments powered by Disqus.
