Previous Article Next Article Table of Contents Journal of Materials Science Letters, Vol.16, No.21, 1753-1756, 1997 DOI10.1023/A:1018527525996 Export Citation Measurement of Thermal-Expansion Coefficients by Electronic Speckle Pattern Interferometry at High-Temperature Kim KS, Kim JH, Lee JK, Jarng SS Keywords:DISPLACEMENT Please enable JavaScript to view the comments powered by Disqus.
