Previous Article Next Article Table of Contents Journal of Materials Science Letters, Vol.17, No.21, 1835-1838, 1998 DOI10.1023/A:1006626124472 Export Citation Adhesion property of copper nitride film to silicon oxide substrate Chwa SO, Kim KH Keywords:THIN-FILMS;RECORDING MEDIA;GROWTH Please enable JavaScript to view the comments powered by Disqus.
