Previous Article Next Article Table of Contents Journal of Materials Science Letters, Vol.18, No.1, 33-34, 1999 DOI10.1023/A:1006665007754 Export Citation Lower temperature and shorter curing time of methylsilsesquioxane for intermetal dielectric application Chua CT, Sarkar G, Chooi SYM, Chan L Please enable JavaScript to view the comments powered by Disqus.
