Previous Article Next Article Table of Contents Journal of Materials Science Letters, Vol.18, No.19, 1599-1602, 1999 DOI10.1023/A:1006616502733 Export Citation Growth behavior of intermetallic compound layer in sandwich-type Ti/Al diffusion couples inserted with Al-Si-Mg alloy foil Lee TW, Kim IK, Lee CH, Kim JH Please enable JavaScript to view the comments powered by Disqus.
