The machining mechanism of woven ceramic matrix composites is one of the most challenging problems in composite application. To elucidate the grinding mechanism of the woven ceramic matrix composites, a new model material consisting of unidirectional CVI-C/SiC was prepared and ground. The composite was ground in three typical directions and the experimental investigation of the surface grinding process for this composite is described. In addition, the micro structural characteristics and grinding mechanism of the composite were analyzed. The result shows that brittle fracture is the dominant removal mechanism for grinding of the C/SiC composites, and the destroy form of the composites is mainly the syntheses of the matrix cracking, fiber fracture, and interfacial debonding. The grinding force follows the order: Normal > Longitudinal > Transverse, and the surface roughness follows: Longitudinal > Normal > Transverse. The grinding parameters (feed speed, cut depth, grinding speed) have great influence on the grinding force and surface roughness. Based on the findings, the grinding force and surface integrity of the woven ceramic matrix composites can be predicted. Furthermore, it is expected to provide a useful guideline for the design, evaluation and optimal application of the C/SiC composites. (C) 2016 Elsevier B.V. All rights reserved.