Journal of Adhesion Science and Technology, Vol.30, No.15, 1662-1670, 2016
The effects of Cu and Al on dry sliding wear properties of eutectic Sn-9Zn lead-free solder alloy
The present study investigates the influence of Cu and Al on microstructure and wear behavior of a eutectic Sn-9Zn solder alloy. The Sn-9Zn-X alloy was produced by adding various amounts of Cu and Al through investment casting method. The produced Sn-9Zn-X alloys were characterized by a scanning electron microscope, X-ray diffraction, and hardness measurements. In wear tests at 1ms(-1) sliding speed, 10N load and 5 different sliding distances (400-2000m) were used. The results show that as the amount of Cu and Al increased within Sn-9Zn alloy, the hardness of the alloy increased as well. Depending on the increase in hardness of the alloys produced by investment casting, it was observed that weight loss decreased during wear tests. Furthermore, the same proportion of added Al alloys' hardness and weight loss were observed to be higher than the added Cu alloys. Furthermore, the Cu-added alloy exhibited higher hardness and lower weight loss than the Al-added alloy did.