Polymer, Vol.93, 167-173, 2016
Synergistic enhancement of electrical and mechanical properties of polypyrrole thin films by hybridization of SiO2 with vapor phase polymerization
This paper reports the fabrication of conductive polypyrrole (PPy)-SiO2 hybrid thin films having a flat surface (surface roughness value < 10 nm) through vapor phase polymerization (VPP) of pyrrole and tetraethyl orthosilicate (TEOS) on a ferric p-toluenesulfonate-coated substrate. Substantial improvement in the physicochemical and electrical properties of the hybrid film, compared to those of the pristine PPy film, could be achieved by simultaneous VPP of pyrrole and TEOS. The SiO2 proportion in the hybrid films, as investigated by X-ray photoelectron spectroscopy, strongly depended on the content of TEOS in the monomer mixture. Formation of a homogeneous interpenetrating network of PPy and silica was indicated by the enhancement of conductivity, atomic force microscopy images, and roughness value of the hybrid film surface. Moreover, a micropatterned PPy-SiO2 hybrid film could be fabricated by micro-molding in capillaries combined with the simultaneous VPP method. Excellent electromechanical stability of PPy-SiO2 hybrid film was confirmed by the post-bending resistance change. Significant electrical degradation of PPy-SiO2 hybrid film was not observed even 11% strain in the compressive condition. (C) 2016 Elsevier Ltd. All rights reserved.
Keywords:Organic-inorganic hybridization;Tetraethoxyorthosilicate;Polypyrrole;Soft lithography;Vapor phase polymerization