플라즈마 제트에서의 분말 용융특성에 따른 Y2O3 코팅층의 미세조직 형성거동

강상운; 백경호; Sang-Woon Kang; Kyeong-Ho Baik

Korean Journal of Materials Research, Vol.26, No.5, 229-234, May, 2016

DOI10.3740/MRSK.2016.26.5.229 Export Citation

플라즈마 제트에서의 분말 용융특성에 따른 Y2O3 코팅층의 미세조직 형성거동

Effects of Powder Melting Degree on Microstructural Features of Plasma Sprayed Y2O3 Coating

강상운, 백경호^†

충남대학교 신소재공학과

Sang-Woon Kang, and Kyeong-Ho Baik^†

Department of Materials Science and Engineering, Chungnam National University, 99 Daehagro, Yuseong, Daejeon, 34134, Republic of Korea

E-mail:

In this study, the degree of particle melting in Y2O3 plasma spraying and its effects on coating characteristics have been investigated in terms of microstructural features, microhardness and scratch resistance. Plasma sprayed Y2O3 coatings were formed using two different powder feeding systems: a system in which the powder is fed inside the plasma gun and a system in which the powder is fed externally. The internal powder spraying method generated a well-defined lamellae structure that was characterized by a thin porous layer at the splat boundary and microcracks within individual splats. Such micro-defects were generated by the large thermal contraction of splats from fully-molten droplets. The external powder spraying method formed a relatively dense coating with a particulate deposition mode, and the deposition of a higher fraction of partially-melted droplets led to a much reduced number of inter-splat pores and intra-splat microcracks. The microhardness and scratch resistance of the Y2O3 coatings were improved by external powder spraying; this result was mainly attributed to the reduced number of micro-defects.

Keywords:Y2O3;plasma spraying;powder melting;inter-splat pore;scratch resistance

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Miwa K, Takada N, Sasaki K, J. Vac. Sci. Technol. A, 27(4), 831 (2009)
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Riu DH, Lee SW, Jeong YK, Choi SC, Key Eng. Mater., 264-8, 601 (2004)
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Baik KH, Grant PS, Cantor B, Acta Mater., 52, 199 (2004)
Fauchais P, J. Phys. D-Appl. Phys., 37, R86 (2004)
Li C, Li C, Wang M, Surf. Coat. Technol., 198, 278 (2005)
Lee HY, Baik KH, Met. Mater. Int., 15, 783 (2009)
So WS, Baik KH, Korean J. Mater. Res., 21(2), 106 (2011)

[1] Van Roosmalen AJ, Baggerman JAG, Brader SJH, Dry Etching for VLSI, p.99, Plenum Press, New York (1991).

[2] Doering R, Nishi Y, Handbook of Semiconductor Manufacturing Technology, p.21, CRC Press, New York (2008).

[3] Kim DM, Kim KB, Yoon SY, Oh YS, Kim HT, Lee SM, J. Ceram. Soc. Jpn., 117, 863 (2009)

[4] Miwa K, Takada N, Sasaki K, J. Vac. Sci. Technol. A, 27(4), 831 (2009)

[5] Ramos R, Cunge G, Pelissier B, Joubert O, Plasma Sources Sci. Technol., 16, 711 (2007)

[6] Kim DM, Yoon SY, Kim KB, Kim HS, Oh YS, Lee SM, J. Korean Ceram. Soc., 45, 707 (2008)

[7] Kim DM, Oh YS, Kim S, Kim HT, Lim DS, Lee SM, Thin Solid Films, 519(20), 6698 (2011)

[8] Beauvais S, Guipont V, Borit F, Jeandin M, Espanol M, Khor KA, Robisson A, Saenger R, Surf. Coat. Technol., 183, 204 (2004)

[9] Tului M, Marino G, Valente T, Surf. Coat. Technol., 201, 2103 (2006)

[10] Seok HK, Choi EY, Cha PR, Son MC, Choi B, Surf. Coat. Technol., 205, 3341 (2011)

[11] Kitamura J, Ibe H, Yuasa F, Mizuno H, J. Therm. Spray Soc., 17, 878 (2008)

[12] Iwasawa J, Nishimizu R, Tokita M, Kiyohara M, Uematsu K, J. Am. Ceram. Soc., 90(8), 2327 (2007)

[13] Choi KY, Oh YS, Kim S, Lee SM, Ceram. Int., 39, 1209 (2013)

[14] Riu DH, Lee SW, Jeong YK, Choi SC, Key Eng. Mater., 264-8, 601 (2004)

[15] Gougousi T, Chen ZY, Thin Solid Films, 516(18), 6197 (2008)

[16] Watanabe T, Kondo M, Nagasaka T, Sagara A, J. Plasma Fusion Res., 9, 342 (2010)

[17] Berkowski M, Bowen P, Liechti T, Scheel HJ, J. Am. Ceram. Soc., 75, 1005 (1992)

[18] Pawlowski L, The Science and Engineering of Thermal Spray Coatings, p.28-50, John Wiley & Sons, New York (1995).

[19] Baik KH, Grant PS, Cantor B, Acta Mater., 52, 199 (2004)

[20] Fauchais P, J. Phys. D-Appl. Phys., 37, R86 (2004)

[21] Li C, Li C, Wang M, Surf. Coat. Technol., 198, 278 (2005)

[22] Lee HY, Baik KH, Met. Mater. Int., 15, 783 (2009)

[23] So WS, Baik KH, Korean J. Mater. Res., 21(2), 106 (2011)