Biphenyl계 에폭시/Phenol Novolac 수지 조성물의 유리전이온도

한승; 김환건; 황성덕; 윤호규; 서광석; 문탁진

Polymer(Korea), Vol.22, No.5, 691-698, September, 1998

Export Citation

Biphenyl계 에폭시/Phenol Novolac 수지 조성물의 유리전이온도

Glass Transition Temperature of Biphenyl-Type Epoxy/Phenol Novolac Resin System

한승, 김환건, 황성덕, 윤호규, 서광석, 문탁진

초록

Biphenyl계 에폭시/phenol novolac 수지 조성물의 유리전이온도와 전화량과의 일대일 관계를 DiBenedetto 방정식과 Hale에 의하여 보완된 DiMarzio 방정식을 이용하여 해석하였다. 경화시간과 유리전이온도와의 관계는 확산-억제된 경화반응 속도식과 Hale의 방정식으로부터 규명하였으며 이 두 식으로부터 biphenyl계 에폭시/phenol novolac 수지 조성물의 시간-온도-변태 등온 도표를 구할 수 있었다.

The one-to-one relationship between the glass transition temperature and the extent of reaction oi biphenyl-type epoxy/phenol novolac resin system was interpreted by using DiBenedetto''s equation and DiMarzio''s equation modified by Hale. The relationship between the glass transition temperature and curing time was investigated by diffusion-controlled cure kinetic equation and Hale''s equation. By combining these two equations, it was possible to construct the time-temperature-transformation (TTT) isothermal cure diagram.

Keywords:biphenyl-type epoxy;phenol novolac;glass transition temperature;diffusion;cure kinetics

[References]

Oh KK, Moon KS, Yoon HG, Moon TJ, Ryu JH, Kim JM, Kim JG, Polym.(Korea), 21(5), 812 (1997)
Han S, Kim WG, Yoon HG, Moon TJ, J. Polym. Sci. A: Polym. Chem., 36(5), 773 (1998)
Han S, Kim WG, Yoon HG, Moon TJ, J. Appl. Polym. Sci., 68(7), 1125 (1998)
Han S, Kim WG, Yoon HG, Moon TJ, Bull. Korean Chem. Soc., 18, 11 (1997)
Han S, Kim WG, Suh KS, Yoon HG, Moon TJ, J. Polym. Sci. A: Polym. Chem., accepted
Horie K, Hiura H, Sawada M, Mita I, Kambe H, J. Polym. Sci. A: Polym. Chem., 8, 1357 (1970)
Gillham JK, Polym. Eng. Sci., 19, 676 (1979)
Matsuoka S, Quan X, Bair HE, Boyle DJ, Macromolecules, 22, 4093 (1989)
Fox TG, Loshaek S, J. Polym. Sci., 15, 371 (1955)
Dimarzio EA, J. Res. Ntl. Bur. Stds. Sect. A, 68A, 611 (1964)
Nielsen LE, J. Macromol. Sci.-Rev. Macromol. Chem. Phys., C3(1), 69 (1969)
Hale A, Macosko CW, Bair HE, Macromolecules, 24, 2610 (1989)
Prime RB, "Thermal Characteristic of Polymeric Materials," ed. by E.A. Turi, Chapter 5, Academic Press, Inc., New York (1981)
Simon SL, Gillham JK, J. Appl. Polym. Sci., 46, 1245 (1992)
Venditti RA, Gillham JK, J. Appl. Polym. Sci., 64(1), 3 (1997)
Barral L, Cano J, Lopez AJ, Lopez J, Nogueira P, Ramirez C, J. Appl. Polym. Sci., 61(9), 1553 (1996)
Miller DR, Macosko CW, Macromolecules, 9, 206 (1976)
Hale A, "Epoxy Used in the Encapsulation of Integrated Circuits: Chemistry, Rheology, Glass Transition, and Reactive Processing," Ph.D. Thesis, University of Minnesota (1988)
Kamal MR, Polym. Eng. Sci., 14, 23 (1974)
Chern CS, Poehlein GW, Polym. Eng. Sci., 27, 782 (1987)
Barral L, Cano J, Lopez AJ, Lopez J, Nogueira P, Ramirez C, J. Appl. Polym. Sci., 56(9), 1029 (1995)

[Referenced By]

[1] Oh KK, Moon KS, Yoon HG, Moon TJ, Ryu JH, Kim JM, Kim JG, Polym.(Korea), 21(5), 812 (1997)

[2] Han S, Kim WG, Yoon HG, Moon TJ, J. Polym. Sci. A: Polym. Chem., 36(5), 773 (1998)

[3] Han S, Kim WG, Yoon HG, Moon TJ, J. Appl. Polym. Sci., 68(7), 1125 (1998)

[4] Han S, Kim WG, Yoon HG, Moon TJ, Bull. Korean Chem. Soc., 18, 11 (1997)

[5] Han S, Kim WG, Suh KS, Yoon HG, Moon TJ, J. Polym. Sci. A: Polym. Chem., accepted

[6] Horie K, Hiura H, Sawada M, Mita I, Kambe H, J. Polym. Sci. A: Polym. Chem., 8, 1357 (1970)

[7] Gillham JK, Polym. Eng. Sci., 19, 676 (1979)

[8] Matsuoka S, Quan X, Bair HE, Boyle DJ, Macromolecules, 22, 4093 (1989)

[9] Fox TG, Loshaek S, J. Polym. Sci., 15, 371 (1955)

[10] Dimarzio EA, J. Res. Ntl. Bur. Stds. Sect. A, 68A, 611 (1964)

[11] Nielsen LE, J. Macromol. Sci.-Rev. Macromol. Chem. Phys., C3(1), 69 (1969)

[12] Hale A, Macosko CW, Bair HE, Macromolecules, 24, 2610 (1989)

[13] Prime RB, "Thermal Characteristic of Polymeric Materials," ed. by E.A. Turi, Chapter 5, Academic Press, Inc., New York (1981)

[14] Simon SL, Gillham JK, J. Appl. Polym. Sci., 46, 1245 (1992)

[15] Venditti RA, Gillham JK, J. Appl. Polym. Sci., 64(1), 3 (1997)

[16] Barral L, Cano J, Lopez AJ, Lopez J, Nogueira P, Ramirez C, J. Appl. Polym. Sci., 61(9), 1553 (1996)

[17] Miller DR, Macosko CW, Macromolecules, 9, 206 (1976)

[18] Hale A, "Epoxy Used in the Encapsulation of Integrated Circuits: Chemistry, Rheology, Glass Transition, and Reactive Processing," Ph.D. Thesis, University of Minnesota (1988)

[19] Kamal MR, Polym. Eng. Sci., 14, 23 (1974)

[20] Chern CS, Poehlein GW, Polym. Eng. Sci., 27, 782 (1987)

[21] Barral L, Cano J, Lopez AJ, Lopez J, Nogueira P, Ramirez C, J. Appl. Polym. Sci., 56(9), 1029 (1995)