The performance of a novel vapor chamber based on the leaf vein system is tested in this study. In this vapor chamber, the conceptual structure, being composed of leaf-vein-like fractal network and micro fin-pins and used to simulate the transportation principle of plant leaf, is made on the inner surface of the top copper plate to form the wick of the condenser. To the inner surface of the bottom, a copper plate sintered with a layer of porous wick is used as the evaporator. Because the conceptual structure is not restricted by the shape, the vapor chamber is made into circular and rectangular shape respectively. In the circular vapor chamber, the supporting columns sintered with copper powder are used to strength the vapor chamber. However, in the rectangular vapor chamber, the wick of the condenser contacts directly with the wick of the evaporator so as to strength the vapor chamber and shorten the back flow length of the liquid condensed on the groove surface. In the circular vapor chamber, the fractal angle of the leaf-vein-like fractal network is 30-70 degrees, and the vapor chamber is packaged with eight bolts for convenience. In the measurement, the vapor chamber has small thermal resistance when the fractal angle is 40 degrees and 50 degrees, and in the rectangular vapor chamber, the thermal resistance of the vapor chamber is about 0.06 C/W. (C) 2016 Elsevier Ltd. All rights reserved.