화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Journal of Industrial and Engineering Chemistry, Vol.42, 131-141, October, 2016
DOI10.1016/j.jiec.2016.07.031  Export Citation
Optimization of printing conditions for microscale multiline printing in continuous roll-to-roll gravure printing
Jongsu Lee1, Janghoon Park1, Hakyung Jeong1, Kee-Hyun Shin2, 3, and Dongjin Lee2, 3, †
  • 1Department of Mechanical Design and Production Engineering, Konkuk University, Seoul 143-701, Republic of Korea
  • 2School of Mechanical Engineering, Konkuk University, Seoul 143-701, Republic of Korea
  • 3Flexible Display Roll-to-roll Research Center, Konkuk University, Seoul 143-701, Republic of Korea
E-mail:
This study proposed new criteria for numerical evaluation of the printability of microscale patterns with various printing defects. Based on these criteria, printing conditions that could be easily tuned in roll-to-roll gravure printing were optimized by a Box.Behnken design of experiment. Under the optimal conditions, sub-30-mm multilines, which have few printing defects, were obtained. Finally, a dimensionless print quality metric was defined for an objective evaluation of printability based on the proposed criteria following verification of its viability.
Keywords:Printed electronics;Roll-to-roll gravure printing;Box-Behnken design of experiment;Ink transfer;Printability
  1. Kang H, Kitsomboonloha R, Jang J, Subramanian V, Adv. Mater., 24(22), 3065 (2012)
  2. Krebs FC, Sol. Energy Mater. Sol. Cells, 93(4), 394 (2009)
  3. Liu S, Ho S, So F, Noh J, ACS Appl. Mater. Interfaces, 8, 9268 (2016)
  4. Lee J, Park S, Park J, Cho YS, Shin KH, Lee D, Int. J. Precis. Eng. Manuf., 16, 2013 (2015)
  5. Lee J, Lee C, Int. J. Mech. Sci., 105, 360 (2016)
  6. Fukuda K, Sekine T, Kumaki D, Tokito S, ACS Appl. Mater. Interfaces, 5, 3916 (2013)
  7. Noh JH, Kim I, Park SH, Jo J, Kim DS, Lee TM, Int. J. Adv. Manuf. Technol., 68, 1147 (2013)
  8. Lee TM, Lee SH, Noh JH, Kim DS, Chun S, J. Micromech. Microeng., 20, 125026 (2010)
  9. Pudas M, Hagberg J, Leppavuori S, J. European Ceram. Soc., 24, 2943 (2004)
  10. Kang HW, Sung HJ, Lee TM, Kim DS, Kim CJ, J. Micromech. Microeng., 19, 15025 (2009)
  11. Ahmed DH, Sung HJ, Kim DS, Int. J. Heat Fluid Flow, 32, 29 (2011)
  12. Hyun WJ, Lim S, Ahn DY, Lewis JA, Frisbie CD, ACS Appl. Mater. Interfaces, 7, 12619 (2015)
  13. Ghadiri F, Ahmed DH, Sung HJ, Shirani E, Int. J. Heat Fluid Flow, 32, 308 (2011)
  14. Kitsomboonoha R, Morris SJS, Rong XY, Subramanian V, Langmuir, 28(48), 16711 (2012)
  15. Cen JL, Kitsomboonloha R, Subramanian V, Langmuir, 30(45), 13716 (2014)
  16. Kitsomboonloha R, Subramanian V, Langmuir, 30(12), 3612 (2014)
  17. Kumar S, Annu. Rev. Fluid Mech., 47, 67 (2015)
  18. Grau G, Scheideler WJ, Subramanian V, Proc. of SPIE, San Diego, USA, 9569, 2015, p. 95690B-1.
  19. Krebs FC, Sol. Energy Mater. Sol. Cells, 93(4), 465 (2009)
  20. Krebs FC, Tromholt T, Jorgensen M, Nanoscale, 2, 873 (2010)
  21. Lee J, Seong J, Park J, Park S, Lee D, Shin KH, Mech. Syst. Signal Process., 60, 706 (2015)
  22. Lee J, Shin KH, Lee C, Robot. Comput. Integr. Manuf., 35, 77 (2015)
  23. Lee JA, Rothstein JP, Pasquali M, J. Non-Newton. Fluid Mech., 199, 1 (2013)
  24. Hrehorova E, Rebros M, Pekarovicova A, Bazuin B, Ranganathan A, Garner S, Merz G, Tosch J, Boudreau R, J. Dispersion Sci. Technol., 7, 318 (2011)
  25. Hrehorova E, Pekarovicova A, Fleming PD, Soc. Imaging Sci. Technol., 107 (2006)
  26. Nguyen HAD, Lee J, Kim CH, Shin KH, Lee D, J. Micromech. Microeng., 23, 095010 (2013)
  27. Lee C, Kang H, Kim C, Shin K, J. Microelectromech. Syst., 19, 1243 (2010)
  28. Park J, Nguyen HAD, Park S, Lee J, Kim B, Lee D, Curr. Appl. Phys., 15(3), 367 (2015)
  29. Annadurai G, Ling LY, Lee JF, J. Hazard. Mater., 151(1), 171 (2008)
  30. Yetilmezsoy K, Demirel S, Vanderbei RJ, J. Hazard. Mater., 171(1-3), 551 (2009)
  31. Yeo LP, Yan YH, Lam YC, Chan-Park MB, Langmuir, 22(24), 10196 (2006)
  32. Roisum DR, The Mechanics of Rollers, Tappi Press, Atlanta, Georgia, USA,1996.
  33. Bhatt S, Pulpytel J, Ceccone G, Lisboa P, Rossi F, Kumar V, Arefi-Khonsari F, Langmuir, 27(23), 14570 (2011)
  34. Li JS, Ma CQ, Ma YH, Li Y, Zhou W, Xu P, Appl. Microbiol. Biotechnol., 74(3), 563 (2007)
  35. Jin R, Chen W, Simpson TW, Struct. Multidiscip. Optim., 23, 1 (2001)
  36. Bohan M, Lim C, Korochkina T, Claypole T, Gethin D, Roylance B, Proc. Inst. Mech. Eng. J., 211, 37 (1997)
  37. Huh C, Mason S, J. Colloid Interface Sci., 60, 11 (1977)
  38. Nakae H, Inui R, Hirata Y, Saito H, Acta Mater., 46, 2313 (1998)
  39. Higgins SG, Boughey FL, Hills R, Steinke JH, Muir BV, Campbell AJ, ACS Appl. Mater. Interfaces, 7, 5045 (2015)
  40. Bezerra MA, Santelli RE, Oliveira EP, Villar LS, Escaleira LA, Talanta, 76, 965 (2008)
  41. Murphy TE, Tsui KL, Allen JK, Res. Eng. Des., 15, 201 (2005)