Epoxy Molding Compound의 경화거동에 관한 연구

윤상영; 오명숙; 박내정; Sang Young Yun; Myongsook Oh; Nae Joung Park

Polymer(Korea), Vol.24, No.6, 837-844, November, 2000

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Epoxy Molding Compound의 경화거동에 관한 연구

A Study on the Cure Behavior of Epoxy Molding Compound

윤상영^†, 오명숙, 박내정

홍익대학교 화학공학과

Sang Young Yun^†, Myongsook Oh, and Nae Joung Park

Department of Chemica Engineering, Hong Ik University, Seoul 121-791, Korea

E-mail:

초록

본 연구에서는 반도체 봉지제로 사용되는 상용 EMC중 가속제의 함량이 다른 두 종류의 프리프레그에 대하여 그 경화거동을 등온 및 승온조건에서 시차 주사 열량계, 점도계 및 유전율 측정계를 이용하여 분석하였다. 경화반응 속도변수는 kamal의 자동촉매 반응식을 이용하여 m+n을 2로 가정한 후 Ryan & Dutta의 방법에 따라 계산하였고 계산에 의한 경화반응 속도의 예측치와 실제 실험 데이터가 100 ℃를 제외한 나머지 온도에서는 잘 일치하는 경향을 나타내었다. 경화과정 중 겔화와 유리화와 같은 상 전이를 관찰하였으며 각각의 등온 경화온도에서 경화시간에 따른 유리전이 온도(T_g)를 측정하여 경화온도와 유리전이 온도가 같아지는 유리화점을 구할 수 있었고 절대온도와의 사이에 Arrhenius관계가 성립함을 확인하였다. 또한 평판형 전극을 이용한 DEA는 EMC의 경화 과정을 동정하는데 효과적으로 이용될 수 있음을 알 수 있었다. 같은 종류의 수지 시스템에서는 TTT diagram 상에서 _gelT_g가 가속제의 농도에 상관없이 일정한 온도에서 나타남을 확인하였다.

The cure behavior of commercial epoxy molding compounds(EMC) commonly used for IC package was studied at constant cure temperatures as well as at constant heating rates using differential scanning calorimetry(DSC), rheometer, and dielectric analyzer(DEA). The cure kinetics were obtained using autocatalytic reaction model according to the Ryan & Dutta method after assuming m+n equal to 2. The prediction of reaction rates by the model equation corresponded well to experimental data at all temperatures except for 100 ℃. The phase transitions such as gelation and vitrification occurred during network formation. At each isothermal cure temperature, T_g was measured in accordance with cure time, and the vitrification point was attained when T_g was equal to T_cure. The temperature dependence of gel points and vitrification points showed good agreement with Arrhenius relation. DEA using parallel plate electrode was effective for the monitoring of EMC cure. we knew that if the resin systems are materials of comparable quality, _gelT_g is constant regardless of accelerator concentration in TTT(Time-Temperature-Transformation) diagram.

Keywords:epoxy molding compounds(EMC);differential scanning calorimetry(DSC);rheometer;dielectric analyzer(DEA);autocatalytic reaction

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[1] Manzione LT, "Plastic Packaging of Microelectronic Devices," p. 68, van Nostrand Reinhold, N.Y., 1990 (1990)

[2] Soane DS, Martynenko Z, "Encapsualations and Packaging of Integrate Circuits," in "Polymers in Microelectronic, Fundamentals and Applications," p. 213, Elsevier, N.Y., 1989 (1989)

[3] Licari JJ, Hugues LA, "Handbook of Polymer Coatings for Electronics," p. 14, Noyes Publications, Park Ridge, N.J., 1990 (1990)

[4] Senturia SD, Sheppard NF, Adv. Polym. Sci., 80, 1 (1986)

[5] Maffezzoli AM, Peterson L, Seferis JC, Polym. Eng. Sci., 33, 75 (1993)

[6] Mackinnon AJ, Jenkins SD, McGrail PT, Petheric RA, Macromolecules, 25, 3492 (1992)

[7] Alig I, Lellinger D, Nancke K, Rizos A, Fytas G, J. Appl. Polym. Sci., 44, 829 (1992)

[8] Kamal MR, Sourour S, Polym. Eng. Sci., 13, 59 (1973)

[9] Lem KW, Han CD, J. Appl. Polym. Sci., 28, 3207 (1983)

[10] Keenan MR, J. Appl. Polym. Sci., 33, 1720 (1987)

[11] Kim H, Eom YS, Chung KM, Ahn KJ, Char K, Polym.(Korea), 19(3), 265 (1995)

[12] Tung CYM, Dynes PJ, J. Appl. Polym. Sci., 27, 569 (1982)

[13] Chambon F, Winter HH, Polym. Bull., B, 499 (1985)

[14] Senturia SD, Sheppard NF, Adv. Polym. Sci., 80, 1 (1986)

[15] Kranbuehl DE, Hood D, Rogozinski J, Limburg W, ACS Prep., 36, 773 (1995)

[16] Ahn KJ, Chung KM, Eom YS, Kim H, Chan K, J. Korean Soc. Compos. Mat., 7, 87 (1994)

[17] May CA, "Epoxy Resins," Marcel Dekker, Inc., New York, 1988 (1988)

[18] Ellis B, "Chemistry and Technology of Epoxy Resin," Blackie Academic and Professional, Glasgow, 1993 (1993)