화학공학소재연구정보센터
Korean Journal of Materials Research, Vol.26, No.12, 751-756, December, 2016
확산 접합에 의해 제조된 텅스텐-레늄 합금/티타늄/그래파이트 접합체의 미세구조 및 고온 안정성
Interfacial Microstructure of Diffusion-Bonded W-25Re/Ti/Graphite Joint and Its High-Temperature Stability
E-mail:
Graphite was diffusion-bonded by hot-pressing to W-25Re alloy using a Ti interlayer. For the joining, a uniaxial pressure of 25 MPa was applied at 1600 °C for 2 hrs in an argon atmosphere with a heating rate of 10 °C min.1. The interfacial microstructure and elemental distribution of the W-25Re/Ti/Graphite joints were analyzed by scanning electron microscopy (SEM). Hot-pressed joints appeared to form a stable interlayer without any micro-cracking, pores, or defects. To investigate the high-temperature stability of the W-25Re/Ti/Graphite joint, an oxy-acetylene torch test was conducted for 30 seconds with oxygen and acetylene at a 1.3:1 ratio. Cross-sectional analysis of the joint was performed to compare the thickness of the oxide layer and its chemical composition. The thickness of W-25Re changed from 250 to 20 μm. In the elemental analysis, a high fraction of rhenium was detected at the surface oxidation layer of W-25Re, while the W-25Re matrix was found to maintain the initial weight ratio. Tungsten was first reacted with oxygen at a torch temperature over 2500 °C to form a tungsten oxide layer on the surface of W-25Re. Then, the remaining rhenium was subsequently reacted with oxygen to form rhenium oxide. The interfacial microstructure of the Ti-containing interlayer was stable after the torch test at a temperature over 2500 °C.
  1. Upadhya K, Yang J, Hoffman W, DTIC Document, (1997).
  2. Huegel FJ, Holman WR, J. Electrochem. Soc., C103, 117 (1970)
  3. Gelfond NV, Morozova NB, Filatov ES, Gromilov SA, Igumenov IK, J. Struct. Chem., 1126, 50 (2009)
  4. Yang SR, Tan CW, Yu XD, Liu KX, Wang ZK, Wang YD, Ma HL, Wang FC, Cai HN, Surf. Coat. Technol., 38, 265 (2015)
  5. Nieh TG, J. Mater. Sci., 2327, 21 (1986)
  6. Jadoon AK, Ralph B, Hornsby PR, J. Mater. Process. Technol., 257, 152 (2004)
  7. Pan R, Wang Q, Sun DL, He P, J. European Ceram. Soc., 219, 35 (2015)
  8. Jung YI, Park JY, Choi BK, Lee JS, Kim HG, Park DJ, Park JH, Kim SK, Lee DW, Cho S, Fusion Eng. Des., 109, 448 (2016)
  9. Hayashi T, Takaoka S, Ichida A, Ohara H, Yoshioka T, Mater. Manuf. Process., 1047, 9 (1994)
  10. Mannheim RL, Garin JL, Key Eng. Mater., 302, 189 (2001)
  11. Naka M, Feng JC, Schuster JC, Metall. Mater. Trans. A-Phys. Metall. Mater. Sci., 1385, 28 (1997)
  12. Li SB, Zhang LT, Cheng LF, Mater. Sci. Technol., 1494, 18 (2002)
  13. Zhang LT, Wu JS, Scr. Mater., 307, 38 (1997)
  14. Schneibel JH, Rawn CJ, Acta Mater., 3843, 52 (2004)