UV/ozone treatment for adhesion improvement of copper/epoxy interface

Shingyu Bok; Guh-Hwan Lim; Byungkwon Lim

Journal of Industrial and Engineering Chemistry, Vol.46, 199-202, February, 2017

DOI10.1016/j.jiec.2016.10.031 Export Citation

UV/ozone treatment for adhesion improvement of copper/epoxy interface

Shingyu Bok, Guh-Hwan Lim, and Byungkwon Lim^†

School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea

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We developed a simple and efficient method for adhesion improvement of Cu/epoxy interface by utilizing UV/ozone treatment for surface oxidation of Cu substrates. X-ray photoelectron spectroscopy analysis revealed that metallic Cu surface was directly oxidized to CuO and Cu(OH)2 by UV/ozone treatment. The adhesion of a UV/ozone-treated and then silane-coated Cu substrate to a molded epoxy layer was greatly improved compared to that of a bare Cu substrate. Using this approach, we obtained the peel strength as high as 0.46 kgf/cm from a low-roughness Cu substrate with Rq of ~0.1 μm.

Keywords:Adhesion;UV/ozone;Copper;Epoxy;Silane coupling agent

[References]

Xu B, Yuen MMF, Wong CKY, Appl. Phys. Lett., 94, 263102 (2009)
Jiang GC, Gu XH, Xue G, Appl. Surf. Sci., 115, 66 (1997)
O’Keefe TJ, Sun BK, Surf. Coat. Technol., 106, 44 (1998)
Wu JZ, Neoh KG, Cui CQ, Lim TB, Kang ET, Int. J. Adhes. Adhes., 20, 467 (2000)
Ge J, Tuominen R, Kivilahti JK, J. Adhes. Sci. Technol., 15(10), 1133 (2001)
Jang J, Earmme T, Polymer, 42(7), 2871 (2001)
Ge J, Turunen MPK, Kivilahti JK, Thin Solid Films, 440(1-2), 198 (2003)
Kim WS, Yun IH, Jung HT, Lee JJ, Int. J. Adhes. Adhes., 30, 408 (2010)
Honkanen M, Vippola M, Lepisto T, Vuorinen J, Hoikkanen M, Prog. Org. Coat., 72, 716 (2011)
Schaubroeck D, Van Den Eeckhout E, De Baets J, Dubruel P, Van Vaeck L, Van Calster A, J. Adhes. Sci. Technol., 26(18-19), 2301 (2012)
You JB, Kim SY, Park YJ, Ko YG, Im SG, Langmuir, 30(3), 916 (2014)
Schaubroeck D, Mader L, Dubruel P, Vanfleteren J, Appl. Surf. Sci., 353, 238 (2015)
Mishra S, Weimer JJ, J. Adhes. Sci. Technol., 11(3), 337 (1997)
Jussila P, Ali-Loytty H, Lahtonen K, Hirsimaki M, Valden M, Surf. Interface Anal., 42, 157 (2010)
Hoque E, DeRose JA, Houriet R, Hoffmann P, Mathieu HJ, Chem. Mater., 19, 798 (2007)
Honkanen M, Hoikkanen M, Vippola M, Vuorinen J, Lepisto T, J. Mater. Sci., 46(20), 6618 (2011)
Gupta V, Madaan N, Jensen DS, Kunzler SC, Linford MR, Langmuir, 29(11), 3604 (2013)
Aliaga C, Park J, Yamada Y, Lee H, Tsung C, Yang P, Somorjai G, J. Phys. Chem. C, 113, 6150 (2009)
Crespo-Quesada M, Andanson JM, Yarulin A, Lim B, Xia YN, Kiwi-Minsker L, Langmuir, 27(12), 7909 (2011)
Ron H, Matlis S, Rubinstein I, Langmuir, 14(5), 1116 (1998)
Huh S, Park J, Kim Y, Kim K, Hong B, Nam J, ACS Nano, 5, 9799 (2011)
Mathieson I, Bradley RH, Int. J. Adhes. Adhes., 16, 29 (1996)
Gong YS, Lee C, Yang CK, J. Appl. Phys., 77, 5422 (1995)
Bellakhal N, Draou K, Brisset JL, J. Appl. Electrochem., 27(4), 414 (1997)
Cho KW, Cho EC, J. Adhes. Sci. Technol., 14(11), 1333 (2000)
Lee CY, Moon WC, Jung SB, Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process., 483, 723 (2008)
Vig JR, J. Vac. Sci. Technol. A, 3, 1027 (1985)
Harding PH, Berg JC, J. Appl. Polym. Sci., 67(6), 1025 (1998)

[Referenced By]

[1] Xu B, Yuen MMF, Wong CKY, Appl. Phys. Lett., 94, 263102 (2009)

[2] Jiang GC, Gu XH, Xue G, Appl. Surf. Sci., 115, 66 (1997)

[3] O’Keefe TJ, Sun BK, Surf. Coat. Technol., 106, 44 (1998)

[4] Wu JZ, Neoh KG, Cui CQ, Lim TB, Kang ET, Int. J. Adhes. Adhes., 20, 467 (2000)

[5] Ge J, Tuominen R, Kivilahti JK, J. Adhes. Sci. Technol., 15(10), 1133 (2001)

[6] Jang J, Earmme T, Polymer, 42(7), 2871 (2001)

[7] Ge J, Turunen MPK, Kivilahti JK, Thin Solid Films, 440(1-2), 198 (2003)

[8] Kim WS, Yun IH, Jung HT, Lee JJ, Int. J. Adhes. Adhes., 30, 408 (2010)

[9] Honkanen M, Vippola M, Lepisto T, Vuorinen J, Hoikkanen M, Prog. Org. Coat., 72, 716 (2011)

[10] Schaubroeck D, Van Den Eeckhout E, De Baets J, Dubruel P, Van Vaeck L, Van Calster A, J. Adhes. Sci. Technol., 26(18-19), 2301 (2012)

[11] You JB, Kim SY, Park YJ, Ko YG, Im SG, Langmuir, 30(3), 916 (2014)

[12] Schaubroeck D, Mader L, Dubruel P, Vanfleteren J, Appl. Surf. Sci., 353, 238 (2015)

[13] Mishra S, Weimer JJ, J. Adhes. Sci. Technol., 11(3), 337 (1997)

[14] Jussila P, Ali-Loytty H, Lahtonen K, Hirsimaki M, Valden M, Surf. Interface Anal., 42, 157 (2010)

[15] Hoque E, DeRose JA, Houriet R, Hoffmann P, Mathieu HJ, Chem. Mater., 19, 798 (2007)

[16] Honkanen M, Hoikkanen M, Vippola M, Vuorinen J, Lepisto T, J. Mater. Sci., 46(20), 6618 (2011)

[17] Gupta V, Madaan N, Jensen DS, Kunzler SC, Linford MR, Langmuir, 29(11), 3604 (2013)

[18] Aliaga C, Park J, Yamada Y, Lee H, Tsung C, Yang P, Somorjai G, J. Phys. Chem. C, 113, 6150 (2009)

[19] Crespo-Quesada M, Andanson JM, Yarulin A, Lim B, Xia YN, Kiwi-Minsker L, Langmuir, 27(12), 7909 (2011)

[20] Ron H, Matlis S, Rubinstein I, Langmuir, 14(5), 1116 (1998)

[21] Huh S, Park J, Kim Y, Kim K, Hong B, Nam J, ACS Nano, 5, 9799 (2011)

[22] Mathieson I, Bradley RH, Int. J. Adhes. Adhes., 16, 29 (1996)

[23] Gong YS, Lee C, Yang CK, J. Appl. Phys., 77, 5422 (1995)

[24] Bellakhal N, Draou K, Brisset JL, J. Appl. Electrochem., 27(4), 414 (1997)

[25] Cho KW, Cho EC, J. Adhes. Sci. Technol., 14(11), 1333 (2000)

[26] Lee CY, Moon WC, Jung SB, Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process., 483, 723 (2008)

[27] Vig JR, J. Vac. Sci. Technol. A, 3, 1027 (1985)

[28] Harding PH, Berg JC, J. Appl. Polym. Sci., 67(6), 1025 (1998)