화학공학소재연구정보센터
Journal of Materials Science, Vol.52, No.2, 1172-1182, 2017
Processing and consolidation of copper/tungsten
We developed a copper/tungsten (Cu/W) composite for mesoscale Materials Science applications using the novel High-Energy Diffraction Microscopy (HEDM) technique. Argon-atomized copper powder was selected as the starting raw powder and screened to remove the extremely large particle fraction. Tungsten particles were collected by milling and screening the -325 mesh tungsten powder between 500 and 635 mesh sieves. Hot pressing of screened Cu powder was performed at 900 A degrees C in Ar/4 %H-2 atmosphere. XRD and ICP results show that the hot-pressed Cu sample consists of about 5 vol% Cu2O, which is caused by the presence of oxygen on the surface of the starting Cu powder. Hot pressing the copper powder in a pure hydrogen atmosphere was successful in removing most of the surface oxygen. This process was also implemented for hot pressing the Cu/W composite. The density of the Cu/W composites hot pressed at 950 A degrees C in pure hydrogen was about 94 % of the theoretical density (TD). The hot-pressed Cu/W composites were further hot isostatic pressed at 1050 A degrees C in argon atmosphere, which results in 99.6 % of the TD with the designed Cu grain size and W particle distribution. Tensile specimens with D-notch were machined using the wire EDM method. The processing and consolidation of these materials will be discussed in detail. The HEDM images are also showed and discussed.