Cu seed layer damage caused by insoluble anode in Cu electrodeposition

Yu Seok Ham; Sung Ki Cho; Jae Jeong Kim

Korean Journal of Chemical Engineering, Vol.34, No.5, 1490-1494, May, 2017

DOI10.1007/s11814-017-0054-9 Export Citation

Cu seed layer damage caused by insoluble anode in Cu electrodeposition

Yu Seok Ham, Sung Ki Cho^{1, †}, and Jae Jeong Kim^†

School of Chemical and Biological Engineering, Institute of Chemical Process, Seoul National University, Gwanak 1, Gwanak-ro, Gwanak-gu, Seoul 08826, Korea
¹Department of Energy and Chemical Engineering, Kumoh National Institute of Technology, 61 Daehak-ro, Gumi-si, Gyeongsangbuk-do 39177, Korea

E-mail:,

We verified that a Cu seed layer could be damaged by a Pt insoluble anode in Cu electrodeposition. When the Cu seed layer was connected to the Pt galvanically, it was pitted and became resistive. The existence of Pt oxides on the Pt developed a potential with respect to the Cu seed layer, and accompanying electron flow from the Cu seed layer to the Pt insoluble anode. This resulted in the dissolution of the Cu seed layer, and the reduction of Pt oxides, which was confirmed by XPS analysis. The pitting current increased with the oxidation time and the surface area of the Pt, indicating the dissolution current on the Cu seed layer was associated with the Pt oxides on the Pt. This study implies that it is necessary to reduce the Pt anode regularly to prevent the Cu seed damage by the Pt anode in Cu electrodeposition.

Keywords:Cu Electrodeposition;Galvanostatic Condition;Pitting Corrosion;Cu Seed Layer Damage;Insoluble Anode

[References]

Kwon OJ, Cho SK, Kim JJ, Korean Chem. Eng. Res., 47(2), 141 (2009)
Kim MJ, Kim JJ, Korean Chem. Eng. Res., 52(1), 26 (2014)
Kulyk N, An CY, Oh JH, Cho SM, Ryu C, Ko YK, Chung CH, Korean J. Chem. Eng., 27(1), 310 (2010)
Kim JS, Choi JH, Korean J. Chem. Eng., 27(4), 1213 (2010)
Kim JJ, Kang MS, Korean Chem. Eng. Res., 39, 721 (2001)
Cho SK, Lim T, Lee HK, Kim JJ, J. Electrochem. Soc., 157(4), D187 (2010)
Martyak NM, Ricou P, Mater. Sci. Semicond. Process, 6, 225 (2003)
Martyak NM, Ricou P, Mater. Chem. Phys., 84(1), 87 (2004)
Park AR, Lee YW, Kwak DH, Park KW, Korean J. Chem. Eng., 32(6), 1075 (2015)
Kim J, Oh SY, Park JY, Kim Y, Korean J. Chem. Eng., 33(1), 344 (2016)
Dini JW, Snyder DD, in Modern Electroplating, Mordechay S, Milan P (Eds.), Wiley (2011).
Bard AJ, Faulkner LR, Electrochemical methods: fundamentals and applications, Wiley (1980).
Kim JJ, Kim SK, Appl. Surf. Sci., 183(3-4), 311 (2001)
Anson FC, Lingane JJ, J. Am. Chem. Soc., 79, 4901 (1957)
Laitinen HA, Enke C, J. Electrochem. Soc., 107, 773 (1960)
Duby P, Jom-J Min Met Mat S, 45, 41 (1993)
Trasatti S, Electrochim. Acta, 45(15-16), 2377 (2000)
Shin S, Choi YW, Choi J, Mater. Lett., 105, 117 (2013)
Cho SK, Kim MJ, Lim T, Kwon OJ, Kim JJ, J. Vac. Sci. Technol. B, 29, 011004 (2011)
Battino R, Rettich TR, Tominaga T, J. Phys. Chem. Ref Data, 12, 163 (1983)

[Related Articles]

[1] Kwon OJ, Cho SK, Kim JJ, Korean Chem. Eng. Res., 47(2), 141 (2009)

[2] Kim MJ, Kim JJ, Korean Chem. Eng. Res., 52(1), 26 (2014)

[3] Kulyk N, An CY, Oh JH, Cho SM, Ryu C, Ko YK, Chung CH, Korean J. Chem. Eng., 27(1), 310 (2010)

[4] Kim JS, Choi JH, Korean J. Chem. Eng., 27(4), 1213 (2010)

[5] Kim JJ, Kang MS, Korean Chem. Eng. Res., 39, 721 (2001)

[6] Cho SK, Lim T, Lee HK, Kim JJ, J. Electrochem. Soc., 157(4), D187 (2010)

[7] Martyak NM, Ricou P, Mater. Sci. Semicond. Process, 6, 225 (2003)

[8] Martyak NM, Ricou P, Mater. Chem. Phys., 84(1), 87 (2004)

[9] Park AR, Lee YW, Kwak DH, Park KW, Korean J. Chem. Eng., 32(6), 1075 (2015)

[10] Kim J, Oh SY, Park JY, Kim Y, Korean J. Chem. Eng., 33(1), 344 (2016)

[11] Dini JW, Snyder DD, in Modern Electroplating, Mordechay S, Milan P (Eds.), Wiley (2011).

[12] Bard AJ, Faulkner LR, Electrochemical methods: fundamentals and applications, Wiley (1980).

[13] Kim JJ, Kim SK, Appl. Surf. Sci., 183(3-4), 311 (2001)

[14] Anson FC, Lingane JJ, J. Am. Chem. Soc., 79, 4901 (1957)

[15] Laitinen HA, Enke C, J. Electrochem. Soc., 107, 773 (1960)

[16] Duby P, Jom-J Min Met Mat S, 45, 41 (1993)

[17] Trasatti S, Electrochim. Acta, 45(15-16), 2377 (2000)

[18] Shin S, Choi YW, Choi J, Mater. Lett., 105, 117 (2013)

[19] Cho SK, Kim MJ, Lim T, Kwon OJ, Kim JJ, J. Vac. Sci. Technol. B, 29, 011004 (2011)

[20] Battino R, Rettich TR, Tominaga T, J. Phys. Chem. Ref Data, 12, 163 (1983)