열전도도 및 전기전도도가 향상된 에폭시/보론나이트라이드/은나노입자 복합체의 제조

김승용; 임순호; Seungyong Kim; Soonho Lim

Korean Chemical Engineering Research, Vol.55, No.3, 426-429, June, 2017

DOI10.9713/kcer.2017.55.3.426 Export Citation

열전도도 및 전기전도도가 향상된 에폭시/보론나이트라이드/은나노입자 복합체의 제조

Improvement of Thermal and Electrical Conductivity of Epoxy/boron Nitride/silver Nanoparticle Composite

김승용, 임순호 ^†

한국과학기술연구원 다기능구조용복합재료연구센터, 55324 전라북도 완주군 봉동읍 추동로 92

Seungyong Kim, and Soonho Lim^†

Multifunctional Structural Composite Research Center, Korea Institute of Science and Technology, 92, Chudong-ro, Bongdong-eup, Wanju, Jeonbuk, 55324, Korea

E-mail:

초록

본 연구에서는 은나노입자 및 보론나이트라이드의 혼합이 열전도도 및 전기전도도에 미치는 효과에 대해 고찰하였다. 에폭시/보론나이트라이드 복합체의 경우 열전도도가 보론나이트라이드의 함량에 비례하여 증가 였으며 에폭시/은나노입자의 경우는 열전도도가 크게 변화 없었으며 전기전도도는 20 vol%에서 퍼콜레이션 현상을 보 주었다. 퍼콜레 이션 함량 이하에서 은나노입자를 고정시키고 보론나이트라이드를 첨가하여 조사한 결과 전기전도도 및 열전도도가 크게 향상됨을 알 수 있었다.

In this study, we investigated the effect of BN (boron nitride) on the thermal and the electrical conductivity of composites. In case of epoxy/BN composites, the thermal conductivity was increased as the BN contents were increased. Epoxy/AgNP (Ag nanoparticle) nanocomposites exhibited a slight change of thermal conductivity and showed a electrical percolation threshold at 20 vol% of Ag nanoparticles. At the fixed Ag nanoparticle content below the electrical percolation threshold, increasing the amount of BN enhanced the electrical conductivity as well as thermal conductivity for the epoxy/AgNP/BN composites

Keywords:Epoxy;Silver nanoparticle;Boron nitride;Thermal conductivity;Electrical conductivity

[References]

Lee SS, “Recent Advances of Conductive Adhesives as a Leadfree Alternative in Electronic Packaging: Maaterials, Processing, Reliability and Applications,” Kosen Expert Review, 1(2006).
Hong J, Shim SE, Chem. Eng., 21, 115 (2010)
Nam S, Cho HW, Kim T, Kim D, Sung BJ, Lim S, Kim H, Appl. Phys. Lett., 99, 043104 (2011)
Cho HW, Nam S, Lim S, Kim D, Kim H, Sung BJ, J. Appl. Phys., 115, 154307 (2014)
Watari K, Sato K, “Fabrication of High Thermal Conductivity Composite Plastic Film with Dispersed Inorganic Particles,” Adv. Ind. Sci. Tech. (2008).
Na HY, Lu X, Lau SK, “Thermal Conductivity of Boron Nitride Filled Thermoplastics: Effect of Filler Characteristics and Composite Processing Conditions,” Poly. Comp., 778-790(2005).
Hong JP, Yoon SW, Hwang TS, Lee YK, Won SH, Nam JD, Korea-Aust. Rheol. J., 22(4), 259 (2010)
Ishida H, Rimdusit S, “Very High Thermal Conductivity Obtained by Boron Nitride Filled Polybenzoxazine,” Thermochimica Acta., 177-186(1998).
Tan FT, Qiao XL, Chen JG, Appl. Surf. Sci., 253(2), 703 (2006)

[Related Articles]

[1] Lee SS, “Recent Advances of Conductive Adhesives as a Leadfree Alternative in Electronic Packaging: Maaterials, Processing, Reliability and Applications,” Kosen Expert Review, 1(2006).

[2] Hong J, Shim SE, Chem. Eng., 21, 115 (2010)

[3] Nam S, Cho HW, Kim T, Kim D, Sung BJ, Lim S, Kim H, Appl. Phys. Lett., 99, 043104 (2011)

[4] Cho HW, Nam S, Lim S, Kim D, Kim H, Sung BJ, J. Appl. Phys., 115, 154307 (2014)

[5] Watari K, Sato K, “Fabrication of High Thermal Conductivity Composite Plastic Film with Dispersed Inorganic Particles,” Adv. Ind. Sci. Tech. (2008).

[6] Na HY, Lu X, Lau SK, “Thermal Conductivity of Boron Nitride Filled Thermoplastics: Effect of Filler Characteristics and Composite Processing Conditions,” Poly. Comp., 778-790(2005).

[7] Hong JP, Yoon SW, Hwang TS, Lee YK, Won SH, Nam JD, Korea-Aust. Rheol. J., 22(4), 259 (2010)

[8] Ishida H, Rimdusit S, “Very High Thermal Conductivity Obtained by Boron Nitride Filled Polybenzoxazine,” Thermochimica Acta., 177-186(1998).

[9] Tan FT, Qiao XL, Chen JG, Appl. Surf. Sci., 253(2), 703 (2006)