Molecular grafting to improve adhesion of spray-deposited circuits on polymeric surface for flexible electronics

Dexin Chen; Zhixin Kang; Takeshi Bessho

Journal of Industrial and Engineering Chemistry, Vol.52, 73-81, August, 2017

DOI10.1016/j.jiec.2017.03.026 Export Citation

Molecular grafting to improve adhesion of spray-deposited circuits on polymeric surface for flexible electronics

Dexin Chen, Zhixin Kang^†, and Takeshi Bessho¹

Guangdong Key Laboratory for Advanced Metallic Materials Processing, School of Mechanical and Automotive Engineering, South China University of Technology, 381 Wushan, Guangzhou 510640, China
¹Higashifuji Technical Center, Toyota Motor Corporation, 1200 Mishuku, Susono, Shizuoka 410-1193, Japan

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An efficient molecular grafting approach is presented to improve interfacial adhesion of logic circuits by virtue of the valuable molecules chemically linked to polymer surfaces. With spray-assisted layer-by- layer deposition, pure metallic Ag coatings with a thickness of 130 gm adhere well to the PET plastics and the homogeneity of the Ag coatings has been studied. In particular, the peel broken site is estimated inside polyester resin beneath the interface. The fabricated flexible circuits maintain high conductivity under various twisting conditions and bending tests, indicating the possibility of producing robust printed circuits onto flexible substrates.

Keywords:Molecular grafting;Interfacial adhesion;Spray-assisted LbL;Flexible electronics;Ag films

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[Referenced By]

[1] Chortos A, Liu J, Bao ZA, Nat. Mater., 15(9), 937 (2016)

[2] Trung TQ, Lee NE, Adv. Mater., 28(22), 4338 (2016)

[3] Amjadi M, Pichitpajongkit A, Lee S, Ryu S, Park I, ACS Nano, 8, 5154 (2014)

[4] Fan X, Zhang XY, Zhang NN, Cheng L, Du J, Tao CY, Electrochim. Acta, 161, 358 (2015)

[5] Wang Y, Guo H, Chen J, Sowade E, Wang Y, Liang K, Marcus K, Baumann RR, Feng Z, ACS Appl. Mater. Interfaces, 8, 26112 (2016)

[6] Lee J, Park J, Jeong H, Shin KH, Lee D, J. Ind. Eng. Chem., 42, 131 (2016)

[7] Bao ZN, Chen XD, Adv. Mater., 28(22), 4177 (2016)

[8] Hu M, Guo Q, Zhang T, Zhou S, Yang J, ACS Appl. Mater. Interfaces, 8, 4280 (2016)

[9] Wang Y, Wang Y, Chen JJ, Guo H, Liang K, Marcus K, Peng QL, Zhang J, Feng ZS, Electrochim. Acta, 218, 24 (2016)

[10] Yang W, Wang C, J. Mater. Chem., 4, 7193 (2016)

[11] Eggenhuisen TM, Galagan Y, Coenen EWC, Voorthuijzen WP, Slaats MWL, Kommeren SA, Shanmuganam S, Coenen MJJ, Andriessen R, Groen WA, Sol. Energy Mater. Sol. Cells, 134, 364 (2015)

[12] Xue MQ, Chen D, Long YJ, Wang PP, Zhao LX, Chen GF, Adv. Mater., 27(24), 3614 (2015)

[13] Hirtz M, Oikonomou A, Clark N, Kim Y, Fuchs H, Vijayaraghavan A, Nanoscale, 8, 15147 (2016)

[14] Matsuhisa N, Kaltenbrunner M, Yokota T, Jinno H, Kuribara K, Sekitani T, Someya T, Nat. Commun, 6, 7461 (2015)

[15] Cao C, Andrews JB, Kumar A, Franklin AD, ACS Nano, 10, 5221 (2016)

[16] Zhang C, Subbaraman H, Li Q, Pan Z, Ok JG, Ling T, Chung C, Zhang X, Li Xn, Chen RT, Guo LJ, J. Mater. Chem., 4, 5133 (2016)

[17] Ok JG, Youn HS, Kwak MK, Lee K, Shin YJ, Guo LJ, Greenwald A, Liu Y, Appl. Phys. Lett., 101, 223102 (2012)

[18] Liu J, Yang C, Zou P, Yang R, Xu C, Xie B, Lin Z, Kang F, Wong CP, J. Mater. Chem., 3, 8329 (2015)

[19] Wang X, Li T, Adams J, Yang J, J. Mater. Chem., 1, 3580 (2013)

[20] Jin YX, Li L, Cheng YR, Kong LQ, Pei QB, Xiao F, Adv. Funct. Mater., 25(10), 1581 (2015)

[21] Kang B, Yun J, Kim S, Yang M, Small, 9, 2111 (2013)

[22] Zhao WX, Ding J, Wang ZL, Langmuir, 29(20), 5968 (2013)

[23] Chen D, Kang Z, Bessho T, RSC Adv., 6, 72256 (2016)

[24] You JB, Kim SY, Park YJ, Ko YG, Im SG, Langmuir, 30(3), 916 (2014)

[25] Gao HL, Zhang XW, Meng JH, Yin ZG, Zhang LQ, Wu JL, Liu X, J. Mater. Chem., 3, 3719 (2015)

[26] Tang X, Cao M, Bi C, Yan L, Zhang B, Mater. Lett., 62, 1089 (2008)

[27] Agina EA, Sizov AS, Yablokov MY, Borshchev OV, Bessonov AA, Kirikova MN, Bailey MJA, Ponomarenko SA, ACS Appl. Mater. Interfaces, 7, 11755 (2015)