Waste printed circuit boards from computers and mobile phones were disintegrated by mech. methods, sepd. on a vibrating sieves and analyzed for metal contents by mass spectroscopy and chem. anal. The Cu and Zn contents decreased with decreasing grain size (56.9% down to 17.9% and 0.550% down to 0.291%, resp.), while the Nd and Ti contents increased with decreasing grain size (0.062% up to 0.312% and 0.031% up to 0.074%, resp.).