The anodic dissolution of pure copper surfaces in acidic chloride solution has been monitored in-situ using combined atomic force - scanning electrochemical microscopy (AFM-SECM). Here, the initial studies performed on model copper-modified substrates have been extended to the investigation of bulk copper samples used in industrial settings. The local release of Cu2+ ions was monitored through electrochemical reduction and deposition of the metal ions on the conductive frame of the AFM-SECM probe. Simultaneous monitoring of the topographical changes due to the corrosion process allowed the distinction and correlation of local passivation and pitting phenomena. The extent of the attack was estimated by anodic stripping of the copper metal deposited at the probe. (C) 2017 Elsevier Ltd. All rights reserved.