This work quantifies the dependence of residual stress in electrodeposited Cu on the grain size and the growth rate. The stress was measured during growth at different rates using wafer curvature. The corresponding grain size was determined after the growth from cross-sectional micrographs. The measurements at different growth rates included pauses that allowed stress changes from grain growth to be separated from the growth stress. The results are analyzed in terms of a kinetic model that predicts the dependence on the growth conditions. This explains the complex interrelationship between growth rate and grain size in determining the stress. (c) 2017 The Electrochemical Society. All rights reserved.