4,4’-Diaminodiphenylacetylene (p-intA) was reacted with 3,3’,4,4’-biphenyltetracarboxylic dianhydride (BPDA), 3,3’,4,4’-benzophenonetetracarboxylic dianhydride (BTDA) and pyromellitic dianhydride (PMDA) in N-methyl-2-pyrrolidone (NMP) to give poly(amic acid) solution of moderate to high viscosity. Thermal imidization gave polyimide having acetylene units that are linked para to the aromatic connecting unit. Polyimide having acetylene units that are linked meta to the aromatic connecting unit also was prepared utilizing 3,3’-diaminodiphenylacetylene (m-intA) for comparison. The crosslinking behavior of the acetylene units was observed with DSC, Exotherm due to the crosslinking of the para-linked acetylene units appeared at ca. 340 to 380 degrees C depending on the structure of polyimide, whereas meta-linked acetylene units appeared at lower temperature as 340-350 degrees C. After thermal treatment at high temperature such as 350 or 400 degrees C, the amount of the exotherm became smaller and finally disappeared on DSC, confirming the progress of crosslinking. Dynamic mechanical properties of the polyimide films show that glass transition temperature increased with higher heat treatment, also confirming the progress of crosslinking. Tensile properties of the polyimide films showed that rigid polyimide films consisting of p-intA with BPDA or PMDA have considerably higher modulus than those consisting of m-intA. Cold-drawing of the poly( amic acid) followed by imidization gave much higher modulus in the case of rigid polyimide.