We manufactured a hybrid adhesive film capable of curable deoxidization by combining thermoplastics and thermosets. The generated acidic moieties on this hybrid adhesive film completely removed the oxide layer of various Sn-based metal solders and Cu, leading to electrical interconnection. The chemical structure, reaction rate, and glass transition temperature (T-g) of the films were examined via Fourier transform infrared spectroscopy and differential scanning calorimetry. The initial reaction rate of the hybrid deoxidizing adhesive films increased with increasing concentration of anhydride and phenoxy resin. Meanwhile, the reaction rate at the end for curing completion decreased as a function of anhydride and phenoxy resin. T-g of the films decreased with the increase in anhydride and phenoxy resin concentrations. The fabricated film resulted in complete wetting of the solder/Cu for electrical interconnection between semiconductor chips as a promising electronic application. This hybrid film can be useful for various applications requiring deoxidization and adhesion.