유기 전자 소자의 봉지막 투습도 분석을 위한 Ytterbium Test

임영지; 이재현; Young-Ji Lim; Jae-Hyun Lee

Applied Chemistry for Engineering, Vol.29, No.4, 484-487, August, 2018

DOI10.14478/ace.2018.1030 Export Citation

유기 전자 소자의 봉지막 투습도 분석을 위한 Ytterbium Test

Ytterbium Test for Water Vapor Transmission Rate Measurement of Passivation Film for Organic Electronics

임영지, 이재현^†

국립한밭대학교 창의융합학과

Young-Ji Lim, and Jae-Hyun Lee^†

Department of Creative Convergence Engineering, Hanbat National University, 125, Dongseo-daero, Yuseong-gu, Daejeon 34158, Korea

E-mail:

초록

본 논문에서는 유기전자소자에서 사용되는 수분 차단막의 투습도 분석을 위하여 ytterbium의 광학적 전기적 특성을 연구하였다. Ytterbium 박막은 다양한 성막 두께(20-100 nm)에 따라 넓은 범위의 광투과도(70-10%)와 비저항(6.0-0.16 mΩ.cm) 값을 나타내었다. 25 nm의 ytterbium 박막은 수분과 반응하여 산화되며 투과도와 저항이 실시간으로 변화하였고 이를 통해 parylene 고분자와 aluminum nitride 적층형 박막 봉지 필름을 분석한 결과 4.3 × 10-3 g/m2ㆍday의 투습도를 측정할 수 있었다.

In this paper, the optical and electrical properties of ytterbium films were studied for water vapor transmission rate (WVTR) analysis of encapsulation films used in organic electronic devices. Ytterbium thin films show a wide range of light transmittance (70-10%) and resistivity (6.0-0.16 mΩ.cm) depending on various film thicknesses (20-100 nm). The Yb thin films were oxidized with moisture and its transmittance and resistance changed in real time. As a result, the WVTR of parylene and aluminum nitride (AlN) laminated thin encapsulation film was measured to be 4.3 × 10-3 g / m2.day with the 25 nm thick ytterbium thin film.

Keywords:water vapor transmission rate;organic light emitting diodes (OLEDs);ytterbium;transmittance;resistivity

[References]

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Bertrand JA, George SM, J. Vac. Sci. Technol., 31, 01A122 (2013)
Lim JW, Mimura K, Isshiki M, Appl. Surf. Sci., 217(1-4), 95 (2003)
Angadi MA, Ashrit PV, Physica Status Solidi A, 77, 685 (1983)
Hogg A, Aellen T, Uhl S, Graf B, Keppner H, Tardy Y, Burger J, J. Micromech. Microeng., 23, 075001 (2013)
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[1] Lee JH, Kim JJ, Physica Status Solidi A, 209, 1399 (2012)

[2] Aziz H, Popovic ZD, Hu NX, Hor AM, Xu G, Science, 283, 1900 (1999)

[3] Meerheim R, Scholz S, Olthof S, Schwartz G, Reineke S, Walzer K, Leo K, J. Appl. Phys., 104, 014510 (2008)

[4] Park JS, Chae H, Chung HK, Lee SI, Semicond. Sci. Technol., 26, 034001 (2011)

[5] Inagaki N, Cech V, Narushima K, Takechi Y, J. Appl. Polym. Sci., 104(2), 915 (2007)

[6] Hermenau M, Schubert S, Klumbies H, Fahlteich J, Muller-Meskamp L, Leo K, Riede M, Sol. Energy Mater. Sol. Cells, 97, 102 (2012)

[7] Burrows PE, Displays, 22, 65 (2001)

[8] Mocon, Inc., Aquatran Model 3, http://www.mocon.com/.

[9] Dunkel R, Bujas R, Klein A, Horndt V, Proc. IEEE, 93, 1478 (2005)

[10] Kempe MD, Reese MO, Dameron AA, Rev. Sci. Instrum., 84, 025109 (2013)

[11] Schubert S, Klumbies H, Muller-Meskamp L, Leo K, Rev. Sci. Instrum., 82, 094101 (2011)

[12] Kim TW, Yan M, Erlat G, McConnelee PA, Pellow M, Deluca J, Feist TP, Duggal AR, Schaepkens M, J. Vac. Sci. Technol. A, 23(4), 971 (2005)

[13] Kumar RS, Auch M, Ou E, Ewald G, Jin CS, Thin Solid Films, 417(1-2), 120 (2002)

[14] Lee JH, Kim A, Org. Electron., 47, 147 (2017)

[15] Bertrand JA, George SM, J. Vac. Sci. Technol., 31, 01A122 (2013)

[16] Lim JW, Mimura K, Isshiki M, Appl. Surf. Sci., 217(1-4), 95 (2003)

[17] Angadi MA, Ashrit PV, Physica Status Solidi A, 77, 685 (1983)

[18] Hogg A, Aellen T, Uhl S, Graf B, Keppner H, Tardy Y, Burger J, J. Micromech. Microeng., 23, 075001 (2013)

[19] Yang GR, Ganguli S, Karcz J, Gill WN, Lu TM, J. Cryst. Growth, 183, 385 (1998)