Vapor deposition polymerized (VDP) polyimide (PI) thin films were prepared and characterized by using thermogravimetrical analysis (TGA), scanning electron microscopy (SEM), atomic force microscopy (AFM), Fourier transform infrared (FTIR), and bending-beam techniques. The film properties investigated were thermal stability, wet-etching characteristics, surface topology, imidization characteristics, internal stress upon curing and thermal cycling, and hygroscopic stress upon moisture diffusion. Markedly different characteristics are observed for the VDP-PI films when comparing with the conventional ones. They seem denser in film structure and have better mechanical properties, but are somewhat less stable in thermal resistance.