Electron microprobe analysis (EMP) was used to study interdiffusion in bilayer films of thermoplastic poly(vinylpyrrolidone) (PVP) and a thermoset epoxy. The bilayer films were prepared by casting a stoichiometric mixture of the uncured diglycidyl ether of bisphenol A epoxy (DGEBA) and 4,4’-diaminodiphenylsulfone (DDS) on the PVP film and then curing the system in a two-step process under a nitrogen atmosphere. For the EMP studies, the sulfur signal was used as a probe for DDS, while the nitrogen signal served as a probe for both DDS and PVP. The addition of brominated DGEBA. to the conventional DGEBA in a 1 : 1 weight ratio allowed the bromine signal to be used as a probe for the epoxy phase. It was found that the interfacial thickness was much larger for the film prepared from low molecular weight PVP than that from high molecular weight PVP. Interdiffusion was suppressed when the initial cure temperature in the two-step cure cycle was 130 degrees C compared to 170 degrees C, in which the first stage of the cure reaction dominated the interdiffusion process. More importantly, it was demonstrated that the diffusion front of the curing agent was located closer to the thermoplastic polymer phase as compared to that of the thermoset polymer in the interface region. This tendency was more significant in the system with the larger interfacial thickness. These results have important consequences on interphase structures and properties. They suggest that crosslinking of the epoxy in the interphase may be suppressed because of an insufficient amount of curing agent and that the not-fully-reacted curing agent in the PVP phase may act to plasticize this phase.