In this study, the effect of micro- and nanoscale energetic materials in the formulation of aluminum microparticles (Al MPs)/aluminum nanoparticles (Al NPs)/iron oxide nanoparticles (Fe2O3 NPs) as a heat energy source for melting solder microparticles (SAC 305 MPs) on the interfacial bonding properties of Cu metallic substrates, is investigated. The optimized mixing ratio is Al MP:Al NP:Fe2O3 NP =30:30:40 wt%, which generates a maximum total exothermic energy of similar to 2.0 kJ g(-1). The presence of Al NPs is essential to make stable ignition and initiation of Al MPs, which enable to attain relatively long combustion duration. The use of highly reactive Al NPs/Fe2O3 NPs can improve the aluminothermic reaction, while the addition of Al MPs to the Al NPs/ Fe2O3 NPs is also required to maintain their high thermal energy for a longer duration. An energetic material (EM) layer composed of Al MP/AI NP/Fe2O3 NP composites is employed as a heat source between solder material (SM) layers composed of SAC305 MPs. The SM/EM/SM multilayer pellets are assembled and ignited between interfacial Cu substrates for bonding. Thus, interfacial bonding between the Cu substrates is successfully achieved, and the resulting maximum mechanical strength for the bonded Cu substrates using the SM/EM/SM multilayer pellets increases by similar to 40% compared to that when using a pure SM layer pellet. Hence, EM layers can act as both an effective heat energy generation source and a mechanical reinforcing medium, while the interfacial bonding process using SM/EM/SM multilayer pellets demonstrated herein provides an easy and versatile means of welding and jointing for industrial applications. (C) 2018 The Combustion Institute. Published by Elsevier Inc. All rights reserved.