Here we demonstrate the adsorption behaviors of typical deposition-targeted metallic (Ag, Cu or Ni) ions on thiol-end surfaces during electroless deposition using for fabricating flexible electronics. Specific thiol-containing silane molecules were assembled onto the corona activated liquid crystal polymer surfaces and then metallic ions were adsorbed onto the modified surfaces. By using X-ray photoelectron spectroscopy, scanning electron microscope and atomic force microscope, the assembly processes, inter-reaction mechanism of these ions with thiol-end groups, and adsorption behaviors have been investigated in details. Thickness of the molecule layer was estimated as some nanometers. Besides, zeta-potential and wettability were used to characterize the surfaces and verify the adsorption behaviors. Overall, this work provides a helpful contribution for understanding circuits' deposition processes and fabricating flexible patterns for electronic devices.