화학공학소재연구정보센터
Korean Journal of Materials Research, Vol.29, No.5, 277-281, May, 2019
Effect of Several Exterior Adhesive Types on Dimensional Stability of Bamboo Oriented ParticleboardEffect of Several Exterior Adhesive Types on Dimensional Stability of Bamboo Oriented Particleboard
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The objective of this research is to evaluate the effect of adhesive types on dimensional stability of bamboo-oriented particleboard. The materials used in this research are bamboo tali(Gigantochloa apus J.A & J.H. Schult. Kurz), UF/MDI(8, 10, 12 % level), and MF, MDI, and PF at 7 % level. Particle and adhesive are mixed using a blending machine; then, mat forming and hot pressing processes are performed using adhesive-suitable temperature and time references. MDI resin is set at 160 °C temperature for 5 minutes. PF resin and MF resin are pressed at 170 °C for 10 minutes, and 140 °C for 10 minutes, respectively, while UF/MDI sets at temperature of 140 °C for 10 minutes. The results show that particleboard using PF resin produces the lowest thickness swelling value. The particleboard using UF/MDI resin also produces good response for thickness swelling value. Interesting things happen in that UF/MDI adhesive produces a thickness swelling value better than that of MDI resin. FTIR analysis on particleboard bonded by UF/MDI resin combination shows the presence of carbonyl group C=O vibration on multi substitution of urea at wave number of around 1,700 cm-1.
  1. Ayrilmis N, Kwon JH, Han TH, Int. J. Adhes. Adhes., 38, 79 (2012)
  2. Sulastiningsih IM, Ruhendi S, Massijaya MY, Darmawan W, Santoso A, J. Ilmu Teknol. Kayu Tropis., 11, 140 (2013)
  3. Iswanto AH, Simarmata J, Fatriasari W, Azhar I, Sucipto T, Hartono R, J. Korean Wood Sci. Technol., 45, 787 (2017)
  4. Iswanto AH, Aritonang W, Azhar I, Fatriasari W, J. Indian Acad. Wood Sci., 14, 1 (2017)
  5. Iswanto AH, Sucipto T, Nadeak SSD, Fatriasari W, IOP Conf. Series: Materials Science and Engineering., 180, 012015 (2017).
  6. Dziurka D, Mirzki R, Drvna Industrija., 65, 115 (2014)
  7. Pizzi A, Valenzuela J, Westermeyer C, Holzforschung, 47, 68 (1983)
  8. Japanese Standard Association, Japanese Industrial Standard (JIS) A 5908, Particleboard, Tokyo, Japan (2003).
  9. Bufalino L, Albino VCS, Sa V, Correa AAR, Mendes LM, Almeida NA, J. Tropical Forest Sci., 24, 162 (2012)
  10. Kelly MW, USDA Forest Service and Forest Product Laboratory University of Wisconsin, USA (1977).
  11. Maloney TM, Miller Freeman Inc. San Francisco, USA (1993).
  12. Osemeahon SA, Barminas JT, Aliyu BA, Int. J. Phys. Sci., 20, 24 (2007)
  13. Rowell RM, Forest Prod. J., 56, 4 (2006)
  14. Krisdianto, Sumarni G, Ismanto A, Ministry of Environment and Forestry Republic of Indonesia, Bogor, Indonesia (2000).
  15. Wieland S, Pizzi A, Grigsby W, Warnes J, Pichelin F, J. Appl. Polym. Sci., 104(4), 2633 (2007)
  16. Bowyer JL, Shmulsky R, Haygreen JG, An Introduction, 4th ed., p. 413, Iowa State University Pr, USA (2003).