The lack of a widely-accepted test standard for characterizing the mode II fatigue disbond growth behavior of adhesively bonded interfaces is a challenge to the research community in terms of producing consistent and repeatable results. Typically, researchers apply the End Notch Flexure specimen, which is already used for static delamination studies. However, the needs for static and fatigue disbond growth characterization are not the same, resulting in some undesirable effects in such specimen. This study looks at a particular mode II test configuration known as the Central Cut Plies (CCP) specimen. A critical evaluation of the suitability of this specimen, including the influence of geometry, disbond measurement approaches and the stability of the disbond growth is carried out through a combination of numerical and experimental investigations. A distributed strain sensing system based on Rayleigh Backscattering provided a surface strain profile from which disbond growth rate data was obtained. A finite element model was used to verify the experimental results and determine the disbond length from the strain profiles. Results of this evaluation have shown that the CCP specimen is a promising specimen configuration for characterizing fatigue disbond growth; however, it also presents several challenges that require consideration in its application.