화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Macromolecular Research, Vol.27, No.11, 1117-1123, November, 2019
DOI10.1007/s13233-019-7155-8  Export Citation
Enhancement of Thermal Conductivity of Poly(methylmethacrylate) Composites at Low Loading of Copper Nanowires
Nhat Anh Thi Thieu, Minh Canh Vu, Eui Sung Lee, Vu Chi Doan, and Sung-Ryong Kim†
  • Department of Polymer Science and Engineering, Korea National University of Transportation, Chungju 27469, Korea
E-mail:
We report the synthesis of copper nanowires (CuNWs) and the enhanced thermal conductivity of poly(methylmethacrylate) (PMMA) composites at low-loading fractions of CuNW. The scanning electron microscope, X-ray diffractometer, thermal diffusivity meter, high-resistance meter, universal testing machine, and thermogravimetric analyzer were used to investigate the properties of CuNW/PMMA composites. The elongation strain to failure, toughness, and thermal stability of the PMMA composites significantly increased with increasing contents of CuNW. The CuNW/PMMA composites showed the thermal conductivity and volume resistivity of 0.85 W/mK and 7×1010Ω·m, respectively, at 2.0 wt% of CuNW. The significant improvement of thermal conductivity is attributed to the well-dispersed CuNWs in the PMMA matrix and the high aspect ratio of CuNWs. The experimental results of thermal conductivity fitted well with the Agari model.
Keywords:Cu nanowires;thermal conductivity;high aspect ratio;toughness;volume resistivity
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